Intellectual Property India Publishes Patent Application for '3D System And Wafer Reconstitution With Mid-Layer Interposer' Filed by Apple Inc.

MUMBAI, India, March 15 -- Intellectual Property India has published a patent application (202517014386 A) filed by Apple Inc., Cupertino, U.S.A., on Feb. 19, for '3d system and wafer reconstitution with mid-layer interposer.'

Inventor(s) include Dabral, Sanjay; and Jangam, Sivachandra.

The application for the patent was published on March 14, under issue no. 11/2025.

According to the abstract released by the Intellectual Property India: "A system in package structure and method of fabrication using wafer reconstitution are described. In an embodiment a 3D system includes a mid-layer interposer a first package level underneath the mid-layer interposer and a second package level over the mid-layer interposer. Second package level componen...