India, May 2 -- Ansys has announced a collaboration with TSMC on multiphysics software for TSMC's Compact Universal Photonic Engines (COUPE).

COUPE is a cutting-edge silicon photonics (SiPh) integration system and co-packaged optics platform that mitigates coupling loss while significantly accelerating chip-to-chip and machine-to-machine communication.

TSMC COUPE, along with Ansys multiphysics solutions that are integrated with Synopsys' 3DIC Compiler unified exploration-to-signoff platform, enables the next generation of silicon photonics and co-packaged optics designs for applications in AI, datacenter, cloud, and HPC communications. The work spans multiple areas, including fiber-to-chip coupling, integrated electronic-photonic chip d...