Seoul, Jan. 6 -- SK hynix unveiled its next generation of artificial intelligence memory chips, including a 16-layer HBM4, at CES 2026 in Las Vegas on Tuesday. The chipmaker opened a customer-only exhibition booth to deepen engagement with key clients as the demand for high-performance memory continues to rise.

According to a report by The Korea Herald, this debut marks a significant step in the company's efforts to provide differentiated memory solutions for the evolving AI ecosystem.

The 16-layer HBM4 model features a capacity of 48 gigabytes. This follows the development of the company's 12-layer HBM4 with 36GB, which previously recorded the industry's fastest speed of 11.7 gigabits per second. The company stated that the new 16-laye...