New Delhi, May 28 -- Samsung Electronics plans to adopt glass substrate interposers from conventional silicon interposers, according to a report by the Korea Herald.

The report, citing Industry sources, says that Samsung plans to make this switch for its advanced semiconductors by 2028 to "meet customer demands."

"In semiconductor manufacturing, interposers are critical in advanced packaging technologies. They connect high-bandwidth memory (HBM) chips with graphics processing units (GPUs) or other logic chips, enabling faster data transfer and improved overall performance," said the news report.

Glass chips in semiconductors refer to the use of ultra-thin glass layers as a substrate or base material for semiconductor chips instead of t...