Seoul, Sept. 17 -- LG Electronics is ramping up efforts to commercialise semiconductor equipment for high-bandwidth memory (HBM) as demand for chip packaging tools surges with the spread of artificial intelligence (AI), as per a report by Pulse, the English service of Maeil Business Newspaper Korea.

As per the Pulse report, the company launched the full-scale development of a hybrid bonder, which has been dubbed the "dream technology" in next-generation processes.

LG is reported to be accelerating its shift toward business-to-business (B2B)-driven "qualitative growth" while seeking synergy across its semiconductor smart factory solutions, heating, ventilation, and air conditioning (HVAC) systems, and chip equipment businesses.

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