Japan, Jan. 21 -- NITTO DENKO CORP has got intellectual property rights for 'LAMINATED FILM.' Other related details are as follows: Application Number: JP,2023-057968 Category (FI): C09J7/22,B32B27/... Read More
Japan, Jan. 21 -- FUJI ELECTRIC CO LTD has got intellectual property rights for 'SEMICONDUCTOR DEVICE.' Other related details are as follows: Application Number: JP,2024-131901 Category (FI): H10D30... Read More
Japan, Jan. 21 -- NEOS CO LTD has got intellectual property rights for 'COATED FILM PIECE COMBUSTION INHIBITION TYPE PEELING AGENT AND COATED FILM PEELING METHOD.' Other related details are as follows... Read More
Japan, Jan. 21 -- SEMICONDUCTOR ENERGY LAB CO LTD has got intellectual property rights for 'POSITIVE ELECTRODE ACTIVE MATERIAL.' Other related details are as follows: Application Number: JP,2024-1194... Read More
Japan, Jan. 21 -- SANYO PRODUCT CO LTD has got intellectual property rights for 'GAME MACHINE.' Other related details are as follows: Application Number: JP,2024-118302 Category (FI): A63F7/02,320,A... Read More
Japan, Jan. 21 -- MAGIC LEAP INC has got intellectual property rights for 'METHOD AND SYSTEM FOR WAVEGUIDE PROJECTOR WITH WIDE FIELD OF VIEW.' Other related details are as follows: Application Number... Read More
Japan, Jan. 21 -- RAN TECHNO:KK has got intellectual property rights for 'PLANT GROWING SYSTEM.' Other related details are as follows: Application Number: JP,2023-055138 Category (FI): A01G27/00,504... Read More
Japan, Jan. 21 -- DENSO CORP has got intellectual property rights for 'SWITCH CIRCUIT.' Other related details are as follows: Application Number: JP,2023-053435 Category (FI): G01R19/00@U,H03K17/687... Read More
Japan, Jan. 21 -- JFE STEEL CORP has got intellectual property rights for 'MEASUREMENT METHOD FOR FASTENING LOAD TO BINDING TARGET MATERIAL WITH BINDING BAND AND BINDING METHOD FOR BINDING TARGET MATE... Read More
Japan, Jan. 21 -- JFE STEEL CORP has got intellectual property rights for 'COKE PRODUCTION METHOD.' Other related details are as follows: Application Number: JP,2023-051052 Category (FI): C10B57/04 ... Read More