Japan, Jan. 21 -- HENNGE KK has got intellectual property rights for 'FILE MANAGEMENT SYSTEM, INFORMATION PROCESSING DEVICE, PROGRAM AND INFORMATION PROCESSING METHOD.' Other related details are as fo... Read More
Japan, Jan. 21 -- PIONEER ELECTRONIC CORP,GEOTECHNOLOGIES INC has got intellectual property rights for 'AUTOMATIC DRIVING SUPPORT DEVICE, CONTROL METHOD, PROGRAM AND STORAGE MEDIUM.' Other related det... Read More
Japan, Jan. 21 -- SAMSUNG DISPLAY CO LTD has got intellectual property rights for 'DISPLAY.' Other related details are as follows: Application Number: JP,2024-096129 Category (FI): H05B33/14@Z,H10K5... Read More
Japan, Jan. 21 -- FUJIFILM CORP has got intellectual property rights for 'IMAGE PROCESSING DEVICE, IMAGE PROCESSING METHOD, AND IMAGE PROCESSING SYSTEM.' Other related details are as follows: Applica... Read More
Japan, Jan. 21 -- TOYOTA MOTOR CORP has got intellectual property rights for 'VEHICLE LOWER PART STRUCTURE.' Other related details are as follows: Application Number: JP,2023-031304 Category (FI): B... Read More
Japan, Jan. 21 -- ZTE CORP has got intellectual property rights for 'INDICATION INFORMATION SENDING METHOD, APPARATUS AND SYSTEM, AND STORAGE MEDIUM.' Other related details are as follows: Applicatio... Read More
Japan, Jan. 21 -- MITSUBISHI CHEMICAL CORP has got intellectual property rights for 'BORON NITRIDE AGGREGATE POWDER, HEAT RADIATION SHEET AND SEMICONDUCTOR DEVICE.' Other related details are as follow... Read More
Japan, Jan. 21 -- SNAP INC has got intellectual property rights for 'LED ARRAYS.' Other related details are as follows: Application Number: JP,2024-094302 Category (FI): H10H29/14,H01L33/32,H01L33/2... Read More
Japan, Jan. 21 -- LEAR CORP has got intellectual property rights for 'AUTOMATED TRENCH MANUFACTURING APPARATUS AND ASSEMBLY FOR ATTACHING TRIM COVERS TO CUSHION ASSEMBLY.' Other related details are as... Read More
Japan, Jan. 21 -- JFE STEEL CORP has got intellectual property rights for 'CRUSHING METHOD OF COAL AND CRUSHING APPARATUS.' Other related details are as follows: Application Number: JP,2023-030472 C... Read More