ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,481,205, issued on Nov. 25, was assigned to CANON K.K. (Tokyo). "Optical apparatus and image pickup apparatus" was invented by Makoto Hayakawa ... Read More
ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,481,141, issued on Nov. 25, was assigned to Thorlabs Inc. (Newton, N.J.). "Compact laser scanning microscope system" was invented by Hongzhou M... Read More
ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,479,205, issued on Nov. 25, was assigned to Seiko Epson Corp. (Tokyo). "Information processing apparatus" was invented by Toshiro Murayama (Fuj... Read More
ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,484,402, issued on Nov. 25, was assigned to CHENGDU BOE OPTOELECTRONICS TECHNOLOGY Co. LTD. (Sichuan, China) and BEIJING BOE TECHNOLOGY DEVELOPM... Read More
ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,484,257, issued on Nov. 25, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING Co. LTD (Hsinchu, Taiwan). "Method of forming gate structures fo... Read More
ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,482,734, issued on Nov. 25, was assigned to SHINKO ELECTRIC INDUSTRIES Co. LTD. (Nagano, Japan). "Laminated wiring board" was invented by Shota... Read More
ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,479,124, issued on Nov. 25, was assigned to Noritake Co. Ltd. (Japan). "Additive manufactured fired body, and method for manufacturing the addi... Read More
ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,483,243, issued on Nov. 25, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor memory device performing recur... Read More
ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,483,277, issued on Nov. 25, was assigned to Intel Corp. (Santa Clara, Calif.). "Quadrature chirp generation" was invented by Evgeny Shumaker (N... Read More
ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,482,723, issued on Nov. 25, was assigned to Raytheon Co. (Arlington, Va.). "Backside metallization of flip-chip semiconductor devices" was inve... Read More