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US Patent Issued to DENSO on Jan. 27 for "Rotary electric machine" (Japanese Inventors)

ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,537,411, issued on Jan. 27, was assigned to DENSO Corp. (Kariya, Japan). "Rotary electric machine" was invented by Eiji Kiba (Kariya, Japan) an... Read More


US Patent Issued on Jan. 27 for "Systems, methods and devices for aiding in the decolonization of bacteria" (Oregon Inventor)

ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,535,933, issued on Jan. 27. "Systems, methods and devices for aiding in the decolonization of bacteria" was invented by Alison Carrigg (Lake Os... Read More


US Patent Issued to LG ENERGY SOLUTION on Jan. 27 for "Electrode assembly, cylindrical battery cell, and battery pack and vehicle including the same" (South Korean Inventors)

ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,537,231, issued on Jan. 27, was assigned to LG ENERGY SOLUTION LTD. (Seoul, South Korea). "Electrode assembly, cylindrical battery cell, and ba... Read More


US Patent Issued to Sensor Electronic Technology on Jan. 27 for "Semiconductor heterostructure with band gap control for improved light emission" (New York, Virginia Inventors)

ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,538,611, issued on Jan. 27, was assigned to Sensor Electronic Technology Inc. (Columbia, S.C.). "Semiconductor heterostructure with band gap co... Read More


US Patent Issued to InterDigital Patent Holdings on Jan. 27 for "Methods of delivery mode switch for multicast and broadcast service in a 5G network" (Pennsylvania, New York Inventors)

ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,538,185, issued on Jan. 27, was assigned to InterDigital Patent Holdings Inc. (Wilmington, Del.). "Methods of delivery mode switch for multicas... Read More


US Patent Issued to TONG HSING ELECTRONIC INDUSTRIES on Jan. 27 for "Power chip packaging structure" (Taiwanese Inventors)

ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,538,832, issued on Jan. 27, was assigned to TONG HSING ELECTRONIC INDUSTRIES LTD. (Taipei, Taiwan). "Power chip packaging structure" was invent... Read More


US Patent Issued to SK SILTRON on Jan. 27 for "Device and method for separating wafers" (South Korean Inventors)

ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,533,873, issued on Jan. 27, was assigned to SK SILTRON Co. LTD. (Gyeongsangbuk-Do, South Korea). "Device and method for separating wafers" was ... Read More


US Patent Issued to Radical Plastics on Jan. 27 for "Compositions and methods of using fine mineral matter as a catalyst for chemical recycling" (Massachusetts Inventor)

ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,534,365, issued on Jan. 27, was assigned to Radical Plastics Inc. (Marblehead, Mass.). "Compositions and methods of using fine mineral matter a... Read More


US Patent Issued to MITUTOYO on Jan. 27 for "Scale configuration for inductive position encoder" (American, Japanese Inventors)

ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,535,339, issued on Jan. 27, was assigned to MITUTOYO Corp. (Kanagawa-Ken, Japan). "Scale configuration for inductive position encoder" was inve... Read More


US Patent Issued to Maxeon Solar on Jan. 27 for "Soft spacers for shingled solar cell panels" (California, Oregon Inventors)

ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,537,478, issued on Jan. 27, was assigned to Maxeon Solar Pte. Ltd. (Singapore). "Soft spacers for shingled solar cell panels" was invented by R... Read More