ALEXANDRIA, Va., Oct. 21 -- United States Patent no. D1,098,177, issued on Oct. 14, was assigned to Apple Inc. (Cupertino, Calif.). "Display screen or portion thereof with animated graphical user int... Read More
ALEXANDRIA, Va., Oct. 21 -- United States Patent no. D1,097,633, issued on Oct. 14, was assigned to Lutron Technology Co. LLC (Coopersburg, Pa.). "Bracket cover applied to a window treatment" was inv... Read More
ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,443,462, issued on Oct. 14, was assigned to NVIDIA Corp. (Santa Clara, Calif.). "Application programming interface using node dependencies" was... Read More
ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,446,328, issued on Oct. 14, was assigned to BOHAN TECHNOLOGIES Co. LTD. (Taichung, Taiwan). "Solar energy generation system" was invented by We... Read More
ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,442,816, issued on Oct. 14, was assigned to BLINK AG (Jena, Germany). "Sensor body for binding and/or enriching and/or detecting an analyte in ... Read More
ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,446,092, issued on Oct. 14, was assigned to NEC Corp. (Tokyo). "Master node, secondary node, and methods therefor" was invented by Hisashi Futa... Read More
ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,440,204, issued on Oct. 14, was assigned to Boston Scientific Scimed Inc. (Maple Grove, Minn.). "Medical device for cutting a suture during a m... Read More
ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,444,714, issued on Oct. 14, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Semiconductor structure" was invent... Read More
ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,444,934, issued on Oct. 14, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Electrostatic discharge (ESD) p... Read More
ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,444,727, issued on Oct. 14, was assigned to CHANGXIN MEMORY TECHNOLOGIES INC. (Hefei, China). "Semiconductor package structure and manufacturin... Read More