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INTERNATIONAL PATENT: LAM RESEARCH CORPORATION FILES APPLICATION FOR "BACKSIDE DEPOSITION OF ANTI-REFLECTIVE (AR) AND HIGH REFLECTIVE (HR) LAYER"

Posted On: 2025-08-05
Government News US Fed News

GENEVA, Aug. 5 -- LAM RESEARCH CORPORATION (4650 Cushing ParkwayFremont, California 94538) filed a patent application (PCT/US2025/011367) for "BACKSIDE DEPOSITION OF ANTI-REFLECTIVE (AR) AND HIGH REFL... Read More

INTERNATIONAL PATENT: QUALCOMM INCORPORATED FILES APPLICATION FOR "OUT-OF-ORDER EXECUTION FOR GRAPHICS PROCESSING UNIT HARDWARE"

Posted On: 2025-08-05
Government News US Fed News

GENEVA, Aug. 5 -- QUALCOMM INCORPORATED (Attn: International IP Administration5775 Morehouse DriveSan Diego, CA 92121-1714) filed a patent application (PCT/US2025/011350) for "OUT-OF-ORDER EXECUTION F... Read More

INTERNATIONAL PATENT: QUALCOMM INCORPORATED FILES APPLICATION FOR "INTEGRATED DEVICES HAVING MULTIPLE DIE ORIENTATIONS"

Posted On: 2025-08-05
Government News US Fed News

GENEVA, Aug. 5 -- QUALCOMM INCORPORATED (ATTN: International IP Administration5775 Morehouse DriveSan Diego, California 92121-1714) filed a patent application (PCT/US2025/010788) for "INTEGRATED DEVIC... Read More

INTERNATIONAL PATENT: MICROSOFT TECHNOLOGY LICENSING, LLC FILES APPLICATION FOR "TELEMETRY DATA PROCESSING USING GENERATIVE MACHINE LEARNING"

Posted On: 2025-08-05
Government News US Fed News

GENEVA, Aug. 5 -- MICROSOFT TECHNOLOGY LICENSING, LLC (One Microsoft WayRedmond, Washington 98052-6399) filed a patent application (PCT/US2024/059259) for "TELEMETRY DATA PROCESSING USING GENERATIVE M... Read More

INTERNATIONAL PATENT: QUALCOMM INCORPORATED FILES APPLICATION FOR "CODING OF POINT CLOUD FRAMES"

Posted On: 2025-08-05
Government News US Fed News

GENEVA, Aug. 5 -- QUALCOMM INCORPORATED (ATTN: International IP Administration5775 Morehouse DriveSan Diego, California 92121-1714) filed a patent application (PCT/US2024/061717) for "CODING OF POINT ... Read More

INTERNATIONAL PATENT: QUALCOMM INCORPORATED FILES APPLICATION FOR "TECHNIQUES FOR TRANSITIONING FROM FULL DUPLEX OPERATION TO HALF DUPLEX OPERATION"

Posted On: 2025-08-05
Government News US Fed News

GENEVA, Aug. 5 -- QUALCOMM INCORPORATED (ATTN: International IP Administration5775 Morehouse DriveSan Diego, California 92121-1714) filed a patent application (PCT/US2024/062278) for "TECHNIQUES FOR T... Read More

INTERNATIONAL PATENT: QUALCOMM INCORPORATED FILES APPLICATION FOR "DOWNLINK MESSAGE PROTECTION FOR AMBIENT WIRELESS DEVICES"

Posted On: 2025-08-05
Government News US Fed News

GENEVA, Aug. 5 -- QUALCOMM INCORPORATED (ATTN: International IP Administration5775 Morehouse DriveSan Diego, CA 92121-1714) filed a patent application (PCT/US2025/011254) for "DOWNLINK MESSAGE PROTECT... Read More

INTERNATIONAL PATENT: THE JOHNS HOPKINS UNIVERSITY FILES APPLICATION FOR "VALIDATING SURGICAL PLANS USING VIRTUAL RESECTIONS VIA DYNAMIC NETWORK BRAIN MODELS"

Posted On: 2025-08-05
Government News US Fed News

GENEVA, Aug. 5 -- THE JOHNS HOPKINS UNIVERSITY (3400 N. Charles StreetBaltimore, MD 21218) filed a patent application (PCT/US2025/011500) for "VALIDATING SURGICAL PLANS USING VIRTUAL RESECTIONS VIA DY... Read More

INTERNATIONAL PATENT: UNIVERSITY OF MIAMI FILES APPLICATION FOR "MITOCHONDRIAL TARGETING SEQUENCES FOR DELIVERY OF RNA TO THE MITOCHONDRIA"

Posted On: 2025-08-05
Government News US Fed News

GENEVA, Aug. 5 -- UNIVERSITY OF MIAMI (1951 NW 7th AvenueSuite 300Miami, Florida 33136) filed a patent application (PCT/US2024/058783) for "MITOCHONDRIAL TARGETING SEQUENCES FOR DELIVERY OF RNA TO THE... Read More

INTERNATIONAL PATENT: QUALCOMM INCORPORATED FILES APPLICATION FOR "PACKAGE SUBSTRATE WITH EMBEDDED CAPACITOR PACKAGE HAVING REDISTRIBUTION LAYER(S) (RDL(S)) FOR ALIGNING CAPACITOR TERMINALS CONNECTIONS TO SEMICONDUCTOR DIE IN AN INTEGRATED CIRCUIT (IC) PACKAGE AND RELATED FABRICATION METHODS"

Posted On: 2025-08-05
Government News US Fed News

GENEVA, Aug. 5 -- QUALCOMM INCORPORATED (ATTN: International IP Administration5775 Morehouse DriveSan Diego, California 92121-1714) filed a patent application (PCT/US2025/010717) for "PACKAGE SUBSTRAT... Read More