ALEXANDRIA, Va., July 30 -- United States Patent no. D1,086,431, issued on July 29. "Air vent cover" was invented by Ji Gao (Riverdale, Md.). The patent was filed on April 6, 2023, under Application... Read More
ALEXANDRIA, Va., July 30 -- United States Patent no. 12,372,812, issued on July 29, was assigned to Purdue Research Foundation (West Lafayette, Ind.). "Three-dimensional electronic devices and method... Read More
ALEXANDRIA, Va., July 30 -- United States Patent no. 12,370,388, issued on July 29, was assigned to Honeywell International Inc. (Charlotte, N.C.). "Smart fall arrest system" was invented by Rahul Ra... Read More
ALEXANDRIA, Va., July 30 -- United States Patent no. D1,086,463, issued on July 29, was assigned to Shenzhen Deda Medical Technology Group Co. Ltd. (Shenzhen, China). "Oxygen concentrator" was invent... Read More
ALEXANDRIA, Va., July 30 -- United States Patent no. 12,373,489, issued on July 29, was assigned to Google LLC (Mountain View, Calif.). "AI-powered video content search" was invented by WeiChung Chan... Read More
ALEXANDRIA, Va., July 30 -- United States Patent no. 12,372,741, issued on July 29, was assigned to Nikon Corp. (Tokyo). "Optical system, optical apparatus, and method for manufacturing optical syste... Read More
ALEXANDRIA, Va., July 30 -- United States Patent no. D1,086,252, issued on July 29, was assigned to ABB Schweiz AG (Baden, Switzerland). "Industrial robot" was invented by Michael Ries (Olching, Germ... Read More
ALEXANDRIA, Va., July 30 -- United States Patent no. 12,373,887, issued on July 29, was assigned to Wells Fargo Bank N.A. (San Francisco). "Systems and methods for collateral deposit identification" ... Read More
ALEXANDRIA, Va., July 30 -- United States Patent no. D1,086,520, issued on July 29, was assigned to Hyundai Motor Co. (Seoul, South Korea) and Kia Corp. (Seoul, South Korea). "Head lamp for an automo... Read More
ALEXANDRIA, Va., July 30 -- United States Patent no. 12,376,231, issued on July 29, was assigned to Apple Inc. (Cupertino, Calif.). "Three-dimensional (3D) copper in printed circuit boards" was inven... Read More