Exclusive

Publication

Byline

Location

US Patent Issued to FUJI ELECTRIC on Sept. 30 for "Semiconductor device" (Japanese Inventor)

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,431,892, issued on Sept. 30, was assigned to FUJI ELECTRIC Co. LTD. (Kawasaki, Japan). "Semiconductor device" was invented by Yuki Kumazawa (M... Read More


US Patent Issued to Kubota on Sept. 30 for "Work vehicle" (Japanese Inventors)

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,428,802, issued on Sept. 30, was assigned to Kubota Corp. (Osaka, Japan). "Work vehicle" was invented by Satoshi Takaki (Sakai, Japan) and Tak... Read More


US Patent Issued to Huawei Technologies'Co., 'Ltd.' on Sept. 30 for "Methods and apparatus for coverage enhancement in wireless communication networks" (Illinois Inventors)

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,432,787, issued on Sept. 30, was assigned to Huawei Technologies'Co.'Ltd.' (Shenzhen, China). "Methods and apparatus for coverage enhancement ... Read More


US Patent Issued on Sept. 30 for "System and method enabling the behavior of radioactive substance within a structure to be determined" (Turkish Inventors)

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,429,611, issued on Sept. 30. "System and method enabling the behavior of radioactive substance within a structure to be determined" was invent... Read More


US Patent Issued to Taiwan Semiconductor Manufacturing on Sept. 30 for "Semiconductor device structure with fin and method for forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,432,954, issued on Sept. 30, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Semiconductor device structure wi... Read More


US Patent Issued to Vestas Wind Systems on Sept. 30 for "Equipotential bonding of wind turbine rotor blade" (Spanish Inventor)

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,429,031, issued on Sept. 30, was assigned to Vestas Wind Systems A/S (Aarhus N., Denmark). "Equipotential bonding of wind turbine rotor blade"... Read More


US Patent Issued to SAMSUNG ELECTRONICS on Sept. 30 for "Memory package performing training operation using address-delay mapping and memory system including the same" (South Korean Inventors)

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,431,173, issued on Sept. 30, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea). "Memory package performing training oper... Read More


US Patent Issued to Apple on Sept. 30 for "Dynamic PIFu enrollment" (California Inventors)

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,430,866, issued on Sept. 30, was assigned to Apple Inc. (Cupertino, Calif.). "Dynamic PIFu enrollment" was invented by Ran Luo (San Jose, Cali... Read More


US Patent Issued to TERUMO on Sept. 30 for "Coating layer inspection device and method for inspecting coating layer" (Japanese Inventors)

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,430,763, issued on Sept. 30, was assigned to TERUMO K.K. (Tokyo). "Coating layer inspection device and method for inspecting coating layer" wa... Read More


US Patent Issued to Micron Technology on Sept. 30 for "Integrated bracket for enhanced heat dissipation" (Indian Inventors)

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,432,880, issued on Sept. 30, was assigned to Micron Technology Inc. (Boise, Idaho). "Integrated bracket for enhanced heat dissipation" was inv... Read More