ALEXANDRIA, Va., March 26 -- United States Patent no. 12,257,820, issued on March 25, was assigned to KCC Glass Corp. (Seoul, South Korea). "Multilayered flooring decorative material" was invented by... Read More
ALEXANDRIA, Va., March 26 -- United States Patent no. 12,262,386, issued on March 25, was assigned to VIVO COMMUNICATION Co. LTD. (Guangdong, China). "Method for HARQ-ACK feedback for PDCCH and devic... Read More
ALEXANDRIA, Va., March 26 -- United States Patent no. 12,260,318, issued on March 25, was assigned to EMEMORY TECHNOLOGY INC. (Hsin-Chu, Taiwan). "Multiply accumulate circuit for binary neural networ... Read More
ALEXANDRIA, Va., March 26 -- United States Patent no. 12,262,514, issued on March 25, was assigned to International Business Machines Corp. (Armonk, N.Y.). "Heat sinks with beyond-board fins" was inv... Read More
ALEXANDRIA, Va., March 26 -- United States Patent no. 12,260,539, issued on March 25, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Apparatus and method of measuring uniformi... Read More
ALEXANDRIA, Va., March 26 -- United States Patent no. 12,262,131, issued on March 25, was assigned to Sony Semiconductor Solutions Corp. (Kanagawa, Japan). "Imaging device and imaging method" was inv... Read More
ALEXANDRIA, Va., March 26 -- United States Patent no. 12,258,447, issued on March 25, was assigned to PI Advanced Materials Co. Ltd. (Jincheon-gun, South Korea). "Polyimide film, method for producing... Read More
ALEXANDRIA, Va., March 26 -- United States Patent no. 12,260,787, issued on March 25, was assigned to BOE TECHNOLOGY GROUP Co. LTD. (Beijing). "Display device" was invented by Haoran Wang (Beijing), ... Read More
ALEXANDRIA, Va., March 26 -- United States Patent no. 12,256,744, issued on March 25, was assigned to KELLANOVA (Battle Creek, Mich.). "Filled snack product with spaced filling lines and method of ma... Read More
ALEXANDRIA, Va., March 26 -- United States Patent no. 12,261,125, issued on March 25, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Method for forming chip package s... Read More