ALEXANDRIA, Va., June 12 -- United States Patent no. 12,299,040, issued on May 13, was assigned to ELIMU INFORMATICS INC. (El Cerrito, Calif.). "System for generating machine learning-based associati... Read More
ALEXANDRIA, Va., June 12 -- United States Patent no. 12,297,053, issued on May 13, was assigned to Intelligrated Headquarters LLC (Mason, Ohio). "Multi shaft transport systems, apparatuses, and metho... Read More
ALEXANDRIA, Va., June 12 -- United States Patent no. 12,298,447, issued on May 13, was assigned to Reveam Inc. (Norcross, Ga.). "Real-time dosimetry" was invented by Chip Starns (Norcross, Ga.) and E... Read More
ALEXANDRIA, Va., June 12 -- United States Patent no. 12,302,171, issued on May 13, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Methods and systems for reducing fronthaul ba... Read More
ALEXANDRIA, Va., June 12 -- United States Patent no. 12,296,889, issued on May 13, was assigned to HYUNDAI MOTOR COMPANY (Seoul, South Korea) and KIA Corp. (Seoul, South Korea). "Battery rear underco... Read More
ALEXANDRIA, Va., June 12 -- United States Patent no. 12,302,454, issued on May 13, was assigned to Huawei Technologies Co. Ltd. (Shenzhen, China). "Power indication method and apparatus" was invented... Read More
ALEXANDRIA, Va., June 12 -- United States Patent no. 12,302,051, issued on May 13, was assigned to Logitech Europe S.A. (Lausanne, Switzerland). "Low profile acoustic module" was invented by Daniel R... Read More
ALEXANDRIA, Va., June 12 -- United States Patent no. 12,298,816, issued on May 13, was assigned to BEIJING XIAOMI MOBILE SOFTWARE Co. LTD. (Beijing). "Method for obtaining data indicating direction, ... Read More
ALEXANDRIA, Va., June 12 -- United States Patent no. D1,075,153, issued on May 13. "Body trimmer" was invented by Jianxin Xiong (Zhejiang, China). The patent was filed on Jan. 7, 2025, under Applica... Read More
ALEXANDRIA, Va., June 12 -- United States Patent no. 12,300,652, issued on May 13, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Substrate and package structure" was... Read More