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US Patent Issued to Charter Communications Operating on May 13 for "Determining service group capacity" (Colorado Inventor)

ALEXANDRIA, Va., June 12 -- United States Patent no. 12,301,377, issued on May 13, was assigned to Charter Communications Operating LLC (St. Louis). "Determining service group capacity" was invented ... Read More


US Patent Issued to EPOCH on May 13 for "Method for manufacturing slash molding mold" (Japanese Inventor)

ALEXANDRIA, Va., June 12 -- United States Patent no. 12,296,389, issued on May 13, was assigned to EPOCH COMPANY LTD. (Tokyo). "Method for manufacturing slash molding mold" was invented by Koichi Nis... Read More


US Patent Issued to GRAVIC on May 13 for "Method and computer program product for detecting and preventing successful attacks at endpoints in a validation architecture system" (Pennsylvania, Florida Inventors)

ALEXANDRIA, Va., June 12 -- United States Patent no. 12,299,163, issued on May 13, was assigned to GRAVIC INC. (Malvern, Pa.). "Method and computer program product for detecting and preventing succes... Read More


US Patent Issued to SNC, on May 13 for "Connector for piping" (South Korean Inventor)

ALEXANDRIA, Va., June 12 -- United States Patent no. 12,297,933, issued on May 13, was assigned to SNC CORPORATION CO., LTD. (Incheon, South Korea). "Connector for piping" was invented by Yuk Nam Cho... Read More


US Patent Issued to Microsoft Technology Licensing on May 13 for "Multiple virtual private network active connection management" (Indian Inventors)

ALEXANDRIA, Va., June 12 -- United States Patent no. 12,301,543, issued on May 13, was assigned to Microsoft Technology Licensing LLC (Redmond, Wash.). "Multiple virtual private network active connec... Read More


US Patent Issued to Tokyo Electron on May 13 for "Substrate support and substrate processing apparatus" (Japanese Inventor)

ALEXANDRIA, Va., June 12 -- United States Patent no. 12,300,475, issued on May 13, was assigned to Tokyo Electron Ltd. (Tokyo). "Substrate support and substrate processing apparatus" was invented by ... Read More


US Patent Issued to SAMSUNG ELECTRONICS on May 13 for "Semiconductor package" (South Korean Inventor)

ALEXANDRIA, Va., June 12 -- United States Patent no. 12,300,675, issued on May 13, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor package" was invented by Jiyoun... Read More


US Patent Issued to OSAKA UNIVERSITY, JFE CIVIL ENGINEERING & CONSTRUCTION, JFE STEEL on May 13 for "Steel damper for seismic isolation and seismic isolation structure" (Japanese Inventors)

ALEXANDRIA, Va., June 12 -- United States Patent no. 12,297,657, issued on May 13, was assigned to OSAKA UNIVERSITY (Suita, Japan), JFE CIVIL ENGINEERING & CONSTRUCTION Corp. (Tokyo) and JFE STEEL Cor... Read More


US Patent Issued to The Boeing on May 13 for "System and method for launching a payload from an aircraft" (California Inventor)

ALEXANDRIA, Va., June 12 -- United States Patent no. 12,296,957, issued on May 13, was assigned to The Boeing Co. (Arlington, Va.). "System and method for launching a payload from an aircraft" was in... Read More


US Patent Issued to SAMSUNG DISPLAY on May 13 for "Display device and driving method thereof" (South Korean Inventors)

ALEXANDRIA, Va., June 12 -- United States Patent no. 12,300,153, issued on May 13, was assigned to SAMSUNG DISPLAY Co. LTD. (Gyeonggi-Do, South Korea). "Display device and driving method thereof" was... Read More