ALEXANDRIA, Va., June 16 -- United States Patent no. 12,303,966, issued on May 20, was assigned to CHINA RAILWAY NO. 4 ENGINEERING GROUP Co. LTD (Hefei, China) and CHUANGZHI ENGINEERING TECHNOLOGY BRA... Read More
ALEXANDRIA, Va., June 16 -- United States Patent no. D1,075,962, issued on May 20. "Toy building block" was invented by Xidi Huang (Shantou, China). The patent was filed on June 8, 2023, under Appli... Read More
ALEXANDRIA, Va., June 16 -- United States Patent no. 12,308,146, issued on May 20, was assigned to PANASONIC INTELLECTUAL PROPERTY MANAGEMENT Co. LTD. (Osaka, Japan). "Multilayer varistor" was invent... Read More
ALEXANDRIA, Va., June 16 -- United States Patent no. 12,303,560, issued on May 20, was assigned to MEDIGEN INC. (Frederick, Md.). "Recombinant bovine immunodeficiency virus-like particles comprising ... Read More
ALEXANDRIA, Va., June 16 -- United States Patent no. 12,307,456, issued on May 20, was assigned to MasterCard International Inc. (Purchase, N.Y.). "Systems and methods for distributing event driven n... Read More
ALEXANDRIA, Va., June 16 -- United States Patent no. D1,076,028, issued on May 20, was assigned to Hangzhou Youyide Network Technology Co. Ltd. (Hangzhou, China). "Hose splitter" was invented by Xiny... Read More
ALEXANDRIA, Va., June 16 -- United States Patent no. 12,308,431, issued on May 20, was assigned to Innolith Technology AG (Basel, Switzerland). "Rechargeable battery cell" was invented by Laurent Zin... Read More
ALEXANDRIA, Va., June 16 -- United States Patent no. 12,308,517, issued on May 20, was assigned to Swiftlink Technologies Inc. (Richmond, Canada). "Periodic mode-selective structure for surface wave ... Read More
ALEXANDRIA, Va., June 16 -- United States Patent no. 12,306,970, issued on May 20, was assigned to GREEN DATA TECHNOLOGY INC. (Seattle). "Authenticating data for storage using a data storage system a... Read More
ALEXANDRIA, Va., June 16 -- United States Patent no. 12,308,329, issued on May 20, was assigned to Intel Corp. (Santa Clara, Calif.). "Chiplet first architecture for die tiling applications" was inve... Read More