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US Patent Issued to NXP USA on Oct. 7 for "Voltage regulator which redundantly monitors for an over-voltage condition based on a regulated voltage provided to a controller and methods" (French, American, German Inventors)

ALEXANDRIA, Va., Oct. 8 -- United States Patent no. 12,436,552, issued on Oct. 7, was assigned to NXP USA Inc. (Austin, Texas). "Voltage regulator which redundantly monitors for an over-voltage condi... Read More


US Patent Issued to Harman International Industries on Oct. 7 for "Loudspeaker assembly with a waveguide" (Michigan Inventors)

ALEXANDRIA, Va., Oct. 8 -- United States Patent no. 12,439,200, issued on Oct. 7, was assigned to Harman International Industries Inc. (Stamford, Conn.). "Loudspeaker assembly with a waveguide" was i... Read More


US Patent Issued to Intel on Oct. 7 for "Adaptation of spatial reuse for extremely high throughput" (French Inventor)

ALEXANDRIA, Va., Oct. 8 -- United States Patent no. 12,439,262, issued on Oct. 7, was assigned to Intel Corp. (Santa Clara, Calif.). "Adaptation of spatial reuse for extremely high throughput" was in... Read More


US Patent Issued on Oct. 7 for "Method and related system for estimating the International Roughness Index of a road segment" (Italian Inventors)

ALEXANDRIA, Va., Oct. 8 -- United States Patent no. 12,434,711, issued on Oct. 7. "Method and related system for estimating the International Roughness Index of a road segment" was invented by Lorenz... Read More


US Patent Issued to SAP on Oct. 7 for "Dynamic operator pruning based on state dependencies and intermediate results" (German Inventor)

ALEXANDRIA, Va., Oct. 8 -- United States Patent no. 12,436,951, issued on Oct. 7, was assigned to SAP SE (Walldorf, Germany). "Dynamic operator pruning based on state dependencies and intermediate re... Read More


US Patent Issued to SAMSUNG ELECTRONICS on Oct. 7 for "Package substrate and semiconductor package including the same" (South Korean Inventors)

ALEXANDRIA, Va., Oct. 8 -- United States Patent no. 12,438,134, issued on Oct. 7, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Package substrate and semiconductor package in... Read More


US Patent Issued to SHANGHAI UNITED IMAGING HEALTHCARE on Oct. 7 for "Method and system for processing multi-modality image" (Chinese Inventors)

ALEXANDRIA, Va., Oct. 8 -- United States Patent no. 12,437,424, issued on Oct. 7, was assigned to SHANGHAI UNITED IMAGING HEALTHCARE Co. LTD. (Shanghai). "Method and system for processing multi-modal... Read More


US Patent Issued to Yangtze Memory Technologies on Oct. 7 for "Dynamic flash memory (DFM) with ring-type insulator in channel for improved retention" (Chinese Inventors)

ALEXANDRIA, Va., Oct. 8 -- United States Patent no. 12,439,584, issued on Oct. 7, was assigned to Yangtze Memory Technologies Co. Ltd. (Wuhan, China). "Dynamic flash memory (DFM) with ring-type insul... Read More


US Patent Issued to SHIN-ETSU CHEMICAL on Oct. 7 for "Film-forming atomizer, film-forming apparatus, and film-forming method" (Japanese Inventor)

ALEXANDRIA, Va., Oct. 8 -- United States Patent no. 12,434,257, issued on Oct. 7, was assigned to SHIN-ETSU CHEMICAL Co. LTD. (Tokyo). "Film-forming atomizer, film-forming apparatus, and film-forming... Read More


US Patent Issued to SAMYANG HOLDINGS on Oct. 7 for "Method for preparing biodegradable polymer microparticles, and biodegradable polymer microparticles prepared thereby" (South Korean Inventors)

ALEXANDRIA, Va., Oct. 8 -- United States Patent no. 12,435,188, issued on Oct. 7, was assigned to SAMYANG HOLDINGS Corp. (Seoul, South Korea). "Method for preparing biodegradable polymer microparticl... Read More