ALEXANDRIA, Va., Oct. 8 -- United States Patent no. 12,437,806, issued on Oct. 7, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Semiconductor device and operatin... Read More
ALEXANDRIA, Va., Oct. 8 -- United States Patent no. 12,439,253, issued on Oct. 7, was assigned to Bank of America Corp. (Charlotte, N.C.). "Single device-level passcode that provides automated access... Read More
ALEXANDRIA, Va., Oct. 8 -- United States Patent no. 12,439,731, issued on Oct. 7, was assigned to Universal Electronics Inc. (Scottsdale, Ariz.). "Controlling device having an energy harvesting featu... Read More
ALEXANDRIA, Va., Oct. 8 -- United States Patent no. 12,439,535, issued on Oct. 7, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Electronic device including elastic member" wa... Read More
ALEXANDRIA, Va., Oct. 8 -- United States Patent no. 12,439,226, issued on Oct. 7, was assigned to Huawei Technologies Co. Ltd. (Shenzhen, China). "Communication method and device" was invented by Bin... Read More
ALEXANDRIA, Va., Oct. 8 -- United States Patent no. 12,437,074, issued on Oct. 7, was assigned to Dell Products LP (Round Rock, Texas). "Modern scalable flash firmware architecture" was invented by S... Read More
ALEXANDRIA, Va., Oct. 8 -- United States Patent no. 12,434,466, issued on Oct. 7, was assigned to NISSIN FOODS HOLDINGS Co. LTD. (Osaka, Japan). "Method for producing microwave-resistant sheet for he... Read More
ALEXANDRIA, Va., Oct. 8 -- United States Patent no. 12,436,307, issued on Oct. 7, was assigned to BP Corporation North America Inc. (Houston). "Method and apparatus for implementing a high-resolution... Read More
ALEXANDRIA, Va., Oct. 8 -- United States Patent no. 12,437,587, issued on Oct. 7, was assigned to TOYOTA JIDOSHA K.K. (Toyota, Japan). "Vehicle diagnostic system" was invented by Hideaki Bunazawa (Na... Read More
ALEXANDRIA, Va., Oct. 8 -- United States Patent no. 12,438,060, issued on Oct. 7, was assigned to Unimicron Technology Corp. (Taoyuan, Taiwan). "Chip package and method of manufacturing the same" was... Read More