ALEXANDRIA, Va., March 12 -- United States Patent no. 12,248,289, issued on March 11, was assigned to Endel Sound GmbH (Berlin). "Systems and methods for generating a continuous music soundscape usin... Read More
ALEXANDRIA, Va., March 12 -- United States Patent no. 12,248,026, issued on March 11, was assigned to SUBARU Corp. (Tokyo). "Impedance measurement system" was invented by Tomohiro Abe (Tokyo). Accor... Read More
ALEXANDRIA, Va., March 12 -- United States Patent no. 12,250,469, issued on March 11, was assigned to KOITO MANUFACTURING Co. LTD. (Tokyo). "Gating camera, sensing system for vehicle, and lighting un... Read More
ALEXANDRIA, Va., March 12 -- United States Patent no. 12,246,989, issued on March 11, was assigned to ETEX BUILDING PERFORMANCE INTERNATIONAL SAS (Avignon, France). "Water repellent composition" was ... Read More
ALEXANDRIA, Va., March 12 -- United States Patent no. 12,250,440, issued on March 11, was assigned to DTEN Inc. (San Jose, Calif.). "Dual conferencing system" was invented by Wei Liu (San Jose, Calif... Read More
ALEXANDRIA, Va., March 12 -- United States Patent no. 12,249,159, issued on March 11, was assigned to DENSO Corp. (Kariya, Japan). "Systems and methods for detecting objects based on lidar data" was ... Read More
ALEXANDRIA, Va., March 12 -- United States Patent no. 12,248,431, issued on March 11, was assigned to VAST DATA LTD. (Tel Aviv, Israel). "Handling case sensitivity of filenames" was invented by Oded ... Read More
ALEXANDRIA, Va., March 12 -- United States Patent no. 12,250,335, issued on March 11, was assigned to Huawei Technologies'Co.'Ltd.' (Shenzhen, China). "Bluetooth connection method, device, and system... Read More
ALEXANDRIA, Va., March 12 -- United States Patent no. 12,248,992, issued on March 11, was assigned to Futurity Group Inc. (Chicago). "Systems, methods, and platforms for automated quality management ... Read More
ALEXANDRIA, Va., March 12 -- United States Patent no. 12,249,553, issued on March 11, was assigned to Intel Corp. (Santa Clara, Calif.). "Thermal contacts at periphery of integrated circuit packages"... Read More