ALEXANDRIA, Va., Oct. 8 -- United States Patent no. 12,437,825, issued on Oct. 7, was assigned to STMicroelectronics International N.V. (Geneva). "At-speed transition fault testing for a multi-port a... Read More
ALEXANDRIA, Va., Oct. 8 -- United States Patent no. 12,436,864, issued on Oct. 7, was assigned to BEIJING BAIDU NETCOM SCIENCE TECHNOLOGY Co. LTD. (Beijing). "Performance testing method and apparatus... Read More
ALEXANDRIA, Va., Oct. 8 -- United States Patent no. 12,438,930, issued on Oct. 7, was assigned to Tencent Technology Co. Ltd. (Shenzhen, China). "Streaming media transmission method and apparatus, el... Read More
ALEXANDRIA, Va., Oct. 8 -- United States Patent no. 12,436,022, issued on Oct. 7, was assigned to BioNex Solutions Inc. (San Jose, Calif.). "Automated in-place weighing of vials in tube racks" was in... Read More
ALEXANDRIA, Va., Oct. 8 -- United States Patent no. 12,437,726, issued on Oct. 7, was assigned to Samsung Display Co. Ltd. (Gyeonggi-do, South Korea). "Display device having a driving transistor with... Read More
ALEXANDRIA, Va., Oct. 8 -- United States Patent no. 12,437,293, issued on Oct. 7, was assigned to Bank of America Corp. (Charlotte, N.C.). "Intelligent method and apparatus for secure payment transac... Read More
ALEXANDRIA, Va., Oct. 8 -- United States Patent no. 12,437,287, issued on Oct. 7, was assigned to MERCEDES-BENZ GROUP AG (Stuttgart, Germany). "Method for performing a payment process of a user by a ... Read More
ALEXANDRIA, Va., Oct. 8 -- United States Patent no. 12,436,806, issued on Oct. 7, was assigned to Dell Products LP (Round Rock, Texas). "Global service catalog for provisioning services on a multi-cl... Read More
ALEXANDRIA, Va., Oct. 8 -- United States Patent no. 12,439,367, issued on Oct. 7, was assigned to Fraunhofer-Gesellschaft zur Foerderung der angewandten Forschung e.V. (Munich). "Determining a positi... Read More
ALEXANDRIA, Va., Oct. 8 -- United States Patent no. 12,438,130, issued on Oct. 7, was assigned to LEDVANCE LLC (Wilmington, Mass.). "Light emitting diode filament including chip scale package light e... Read More