ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,550,353, issued on Feb. 10, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Gate capping structures in semicond... Read More
ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,547,270, issued on Feb. 10, was assigned to SAMSUNG DISPLAY Co. LTD. (Yongin-si, South Korea). "Display device" was invented by Heerim Song (Yo... Read More
ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,550,484, issued on Feb. 10, was assigned to Enkris Semiconductor (Wuxi) Ltd. (Wuxi, China). "LED structure with stress releasing layers compris... Read More
ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,546,943, issued on Feb. 10, was assigned to FURUKAWA ELECTRIC Co. LTD. (Tokyo). "Optical device and optical apparatus" was invented by Masahiro... Read More
ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,549,402, issued on Feb. 10, was assigned to Hewlett Packard Enterprise Development LP (Spring, Texas). "Multicast for multifabric virtualized n... Read More
ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,547,935, issued on Feb. 10, was assigned to Blueshift Labs Inc. (San Francisco). "Optimizing product searches based on communications engagemen... Read More
ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,545,795, issued on Feb. 10, was assigned to HARIMA CHEMICALS Inc. (Kakogawa, Japan). "Resin composition for aqueous ink" was invented by Dario ... Read More
ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,548,457, issued on Feb. 10, was assigned to TELEFONAKTIEBOLAGET LM ERICSSON (PUBL) (Stockholm). "Method and arrangement for assisted execution ... Read More
ALEXANDRIA, Va., Feb. 11 -- United States Patent no. D1,112,966, issued on Feb. 10, was assigned to RentAcoop LLC (Germantown, Md.). "Brooder box" was invented by Tyler Phillips (Germantown, Md.) and... Read More
ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,545,839, issued on Feb. 10, was assigned to SCREEN Holdings Co. Ltd. (Kyoto, Japan). "Substrate processing method and substrate processing appa... Read More