US Patent Issued to Salomon on Sept. 23 for "Footwear" (French Inventor)

ALEXANDRIA, Va., Sept. 23 -- United States Patent no. D1,093,825, issued on Sept. 23, was assigned to Salomon S.A.S. (Metz-Tessy, France). "Footwear" was invented by Guillaume Salmon (Annecy, France)... Read More

US Patent Issued to ALPS ALPINE on Sept. 23 for "Audio speaker enclosure" (Japanese Inventor)

ALEXANDRIA, Va., Sept. 23 -- United States Patent no. D1,094,334, issued on Sept. 23, was assigned to ALPS ALPINE Co. LTD. (Tokyo). "Audio speaker enclosure" was invented by Hideki Endo (Ota-ku, Japa... Read More

US Patent Issued to CHANGSHA UNIVERSITY OF SCIENCE AND TECHNOLOGY on Sept. 23 for "Hierarchical energy management for community microgrids with integration of second-life battery energy storage systems and photovoltaic solar energy" (Chinese Inventors)

ALEXANDRIA, Va., Sept. 23 -- United States Patent no. 12,422,800, issued on Sept. 23, was assigned to CHANGSHA UNIVERSITY OF SCIENCE AND TECHNOLOGY (Changsha, China). "Hierarchical energy management ... Read More

US Patent Issued to COMPREMIUM on Sept. 23 for "Replaceable attachment for an ultrasound probe" (Swiss Inventors)

ALEXANDRIA, Va., Sept. 23 -- United States Patent no. 12,419,609, issued on Sept. 23, was assigned to COMPREMIUM AG (Muri b. Bern, Switzerland). "Replaceable attachment for an ultrasound probe" was i... Read More

US Patent Issued to AutoNetworks Technologies, Sumitomo Wiring Systems, Sumitomo Electric Industries on Sept. 23 for "In-vehicle system and in-vehicle ECU" (Japanese Inventor)

ALEXANDRIA, Va., Sept. 23 -- United States Patent no. 12,420,812, issued on Sept. 23, was assigned to AutoNetworks Technologies Ltd. (Yokkaichi, Japan), Sumitomo Wiring Systems Ltd. (Yokkaichi, Japan)... Read More

US Patent Issued to Beijing BOE Technology Development, BOE Technology Group on Sept. 23 for "Method for manufacturing array substrate, array substrate, display panel, and display device" (Chinese Inventor)

ALEXANDRIA, Va., Sept. 23 -- United States Patent no. 12,426,488, issued on Sept. 23, was assigned to Beijing BOE Technology Development Co. Ltd. (Beijing) and BOE Technology Group Co. Ltd. (Beijing).... Read More

US Patent Issued to UNIMICRON TECHNOLOGY on Sept. 23 for "Circuit board structure and method for forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 23 -- United States Patent no. 12,426,168, issued on Sept. 23, was assigned to UNIMICRON TECHNOLOGY CORP. (Taoyuan, Taiwan). "Circuit board structure and method for forming the... Read More

US Patent Issued to Acushnet on Sept. 23 for "Multi-layer golf balls with improved interlayer adhesion" (Massachusetts Inventors)

ALEXANDRIA, Va., Sept. 23 -- United States Patent no. 12,420,147, issued on Sept. 23, was assigned to Acushnet Co. (Fairhaven, Mass.). "Multi-layer golf balls with improved interlayer adhesion" was i... Read More

US Patent Issued to CHINA MOBILE SHANGHAI ICT, CM INTELLIGENT MOBILITY, CHINA MOBILE COMMUNICATIONS GROUP on Sept. 23 for "Information sending method, apparatus and device, and computer storage medium" (Chinese Inventors)

ALEXANDRIA, Va., Sept. 23 -- United States Patent no. 12,422,564, issued on Sept. 23, was assigned to CHINA MOBILE SHANGHAI ICT Co. LTD. (Shanghai), CM INTELLIGENT MOBILITY (Shanghai) and CHINA MOBILE... Read More

US Patent Issued to MURATA MANUFACTURING on Sept. 23 for "Power amplifier circuit" (Japanese Inventors)

ALEXANDRIA, Va., Sept. 23 -- United States Patent no. 12,424,982, issued on Sept. 23, was assigned to MURATA MANUFACTURING Co. LTD. (Kyoto, Japan). "Power amplifier circuit" was invented by Takashi S... Read More

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