ALEXANDRIA, Va., July 30 -- United States Patent no. D1,086,102, issued on July 29, was assigned to SCAN2CAD INC. (St Petersburg, Fla.). "Interface adapter" was invented by Hechuan Xu (Shanghai). Th... Read More
ALEXANDRIA, Va., July 30 -- United States Patent no. 12,372,821, issued on July 29, was assigned to Atieva Inc. (Newark, Calif.). "Vehicle display device with reduced window glare" was invented by Ri... Read More
ALEXANDRIA, Va., July 30 -- United States Patent no. 12,371,540, issued on July 29, was assigned to KURARAY Co. LTD. (Okayama, Japan). "Water-soluble film and package" was invented by Minoru Okamoto ... Read More
ALEXANDRIA, Va., July 30 -- United States Patent no. 12,372,045, issued on July 29, was assigned to SAFRAN NACELLES (Gonfreville-l'Orcher, France). "Guide assembly for an aircraft propulsion unit" wa... Read More
ALEXANDRIA, Va., July 30 -- United States Patent no. 12,371,028, issued on July 29, was assigned to Robert Bosch GmbH (Stuttgart, Germany). "Occupant determination device" was invented by Joan Marc B... Read More
ALEXANDRIA, Va., July 30 -- United States Patent no. 12,371,191, issued on July 29, was assigned to SUBARU Corp. (Tokyo). "Method of producing structure" was invented by Yoichi Sato (Tokyo), Yutaka Y... Read More
ALEXANDRIA, Va., July 30 -- United States Patent no. 12,373,245, issued on July 29, was assigned to JPMORGAN CHASE BANK N.A. (New York). "Systems and methods for configuration driven integration of s... Read More
ALEXANDRIA, Va., July 30 -- United States Patent no. 12,375,705, issued on July 29, was assigned to BEIJING DAJIA INTERNET INFORMATION TECHNOLOGY Co. LTD. (Beijing). "System and method for signaling ... Read More
ALEXANDRIA, Va., July 30 -- United States Patent no. 12,372,051, issued on July 29, was assigned to MITSUBISHI HEAVY INDUSTRIES ENGINE TURBOCHARGER LTD. (Sagamihara, Japan). "Fuel pump" was invented ... Read More
ALEXANDRIA, Va., July 30 -- United States Patent no. 12,376,382, issued on July 29, was assigned to Monolithic 3D Inc. (Klamath Falls, Ore.). "3D semiconductor devices and structures with metal layer... Read More