US Patent Issued to Canon on Nov. 25 for "Information processing apparatus that displays a screen including a code image to allow an external apparatus to read the code image and execute a web application, information processing method and storage medium" (Japanese Inventor)

ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,481,714, issued on Nov. 25, was assigned to Canon K.K. (Tokyo). "Information processing apparatus that displays a screen including a code image... Read More

US Patent Issued to Silicon Laboratories on Nov. 25 for "Coordinated roaming for low energy roaming aware peripheral devices" (Indian Inventor)

ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,483,941, issued on Nov. 25, was assigned to Silicon Laboratories Inc. (Austin, Texas). "Coordinated roaming for low energy roaming aware periph... Read More

US Patent Issued to Huawei Technologies on Nov. 25 for "Bandwidth indication method applied in wireless local area network and communication apparatus" (Chinese Inventors)

ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,483,364, issued on Nov. 25, was assigned to Huawei Technologies Co. Ltd. (Shenzhen, China). "Bandwidth indication method applied in wireless lo... Read More

US Patent Issued to MediaTek on Nov. 25 for "Buck converter with high power efficiency" (Taiwanese Inventors)

ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,483,124, issued on Nov. 25, was assigned to MediaTek Inc. (Hsinchu, Taiwan). "Buck converter with high power efficiency" was invented by Chih-C... Read More

US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Nov. 25 for "Semiconductor structure with self-aligned backside power rail" (Taiwanese Inventors)

ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,484,298, issued on Nov. 25, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING Co. LTD. (Hsinchu, Taiwan). "Semiconductor structure with self-a... Read More

US Patent Issued to Taiwan Semiconductor Manufacturing on Nov. 25 for "Trim free wafer bonding methods and devices" (Taiwanese Inventors)

ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,482,785, issued on Nov. 25, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Trim free wafer bonding methods and... Read More

US Patent Issued to Sharp on Nov. 25 for "Method performed by user equipment, and user equipment" (Chinese Inventors)

ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,484,048, issued on Nov. 25, was assigned to Sharp K.K. (Sakai, Japan). "Method performed by user equipment, and user equipment" was invented by... Read More

US Patent Issued to Capital One Services on Nov. 25 for "Architecture of immutable database for bitemporal analysis" (Virginia Inventors)

ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,481,990, issued on Nov. 25, was assigned to Capital One Services LLC (McLean, Va.). "Architecture of immutable database for bitemporal analysis... Read More

US Patent Issued to FURUKAWA ELECTRIC on Nov. 25 for "Multicore fiber, manufacturing method for multicore fiber, multicore fiber preform, and manufacturing method for multicore fiber preform" (Japanese Inventors)

ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,481,097, issued on Nov. 25, was assigned to FURUKAWA ELECTRIC Co. LTD. (Tokyo). "Multicore fiber, manufacturing method for multicore fiber, mul... Read More

US Patent Issued to Dell Products on Nov. 25 for "Processor environment agnostic basic input output system timing configuration management" (Indian Inventors)

ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,481,508, issued on Nov. 25, was assigned to Dell Products LP (Round Rock, Texas). "Processor environment agnostic basic input output system tim... Read More

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