ALEXANDRIA, Va., April 9 -- United States Patent no. 12,268,609, issued on April 8, was assigned to Howmedica Osteonics Corp. (Mahwah, N.J.). "Method of manufacturing a tibial implant" was invented b... Read More
ALEXANDRIA, Va., April 9 -- United States Patent no. 12,273,228, issued on April 8. "Deep fusing of clos star networks to form a global contiguous web" was invented by Maged E. Beshai (Maberly, Canad... Read More
ALEXANDRIA, Va., April 9 -- United States Patent no. 12,269,495, issued on April 8, was assigned to PANASONIC AUTOMOTIVE SYSTEMS Co. LTD. (Kanagawa, Japan). "Vehicle approach notification system and ... Read More
ALEXANDRIA, Va., April 9 -- United States Patent no. 12,268,876, issued on April 8, was assigned to Flathead Partners LLC (Minneapolis). "Neural blocking therapy" was invented by Mark B. Knudson (Sho... Read More
ALEXANDRIA, Va., April 9 -- United States Patent no. D1,069,638, issued on April 8. "Gemstone" was invented by Jacob Siman Tov (Ramat Gan, Israel), Itzhak Siman Tov (Ramat Gan, Israel) and Avraham Si... Read More
ALEXANDRIA, Va., April 9 -- United States Patent no. 12,269,111, issued on April 8, was assigned to CITIZEN WATCH Co. LTD. (Tokyo). "Machine tool and control method of machine tool" was invented by A... Read More
ALEXANDRIA, Va., April 9 -- United States Patent no. 12,272,088, issued on April 8, was assigned to Vueron Technology Co. Ltd. (Seoul, South Korea). "Method for detecting crosswalk using Lidar sensor... Read More
ALEXANDRIA, Va., April 9 -- United States Patent no. 12,272,568, issued on April 8, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Semiconductor package and manufactu... Read More
ALEXANDRIA, Va., April 9 -- United States Patent no. 12,272,557, issued on April 8, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Semiconductor device and method" wa... Read More
ALEXANDRIA, Va., April 9 -- United States Patent no. 12,272,666, issued on April 8, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (South Korea). "Semiconductor package and method of manufacturing the ... Read More