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US Patent Issued to Intel on June 24 for "Planar slab vias for integrated circuit interconnects" (Oregon Inventors)

ALEXANDRIA, Va., June 25 -- United States Patent no. 12,341,092, issued on June 24, was assigned to Intel Corp. (Santa Clara, Calif.). "Planar slab vias for integrated circuit interconnects" was inve... Read More


US Patent Issued to UNICASK on June 24 for "System for managing storage-state data and ownership certification of by-the-barrel liquor" (Japanese Inventors)

ALEXANDRIA, Va., June 25 -- United States Patent no. 12,340,343, issued on June 24, was assigned to UNICASK Co. LTD. (Tokyo). "System for managing storage-state data and ownership certification of by... Read More


US Patent Issued to Yamaha Motor, USA on June 24 for "Dynamic user interaction environment" (California Inventors)

ALEXANDRIA, Va., June 25 -- United States Patent no. 12,340,712, issued on June 24, was assigned to Yamaha Motor Corporation, USA (Cypress, Calif.). "Dynamic user interaction environment" was invente... Read More


US Patent Issued to EQUIFAX on June 24 for "Controlling access to secured data via timed filtering of data" (Texas, Georgia Inventors)

ALEXANDRIA, Va., June 25 -- United States Patent no. 12,341,784, issued on June 24, was assigned to EQUIFAX INC. (Atlanta). "Controlling access to secured data via timed filtering of data" was invent... Read More


US Patent Issued to SAMSUNG ELECTRONICS on June 24 for "Semiconductor package with increased thermal dissipation" (South Korean Inventors)

ALEXANDRIA, Va., June 25 -- United States Patent no. 12,341,074, issued on June 24, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea). "Semiconductor package with increased ther... Read More


US Patent Issued to CHANGXIN MEMORY TECHNOLOGIES on June 24 for "Semiconductor structure and manufacturing method thereof" (Chinese Inventors)

ALEXANDRIA, Va., June 25 -- United States Patent no. 12,342,586, issued on June 24, was assigned to CHANGXIN MEMORY TECHNOLOGIES INC. (Hefei, China). "Semiconductor structure and manufacturing method... Read More


US Patent Issued to UNITED ARAB EMIRATES UNIVERSITY on June 24 for "Hybrid and sustainable bio-composite construction repair material for construction enriched with MWCNT" (Emirati Inventors)

ALEXANDRIA, Va., June 25 -- United States Patent no. 12,338,176, issued on June 24, was assigned to UNITED ARAB EMIRATES UNIVERSITY (Al Ain, United Arab Emirates). "Hybrid and sustainable bio-composi... Read More


US Patent Issued to Sony Semiconductor Solutions on June 24 for "Solid-state image sensor" (Japanese Inventors)

ALEXANDRIA, Va., June 25 -- United States Patent no. 12,342,093, issued on June 24, was assigned to Sony Semiconductor Solutions Corp. (Kanagawa, Japan). "Solid-state image sensor" was invented by Te... Read More


US Patent Issued on June 24 for "Methods for improvements of the closed wing aircraft concept and corresponding aircraft configurations" (Swedish Inventor)

ALEXANDRIA, Va., June 25 -- United States Patent no. 12,337,966, issued on June 24. "Methods for improvements of the closed wing aircraft concept and corresponding aircraft configurations" was invent... Read More


US Patent Issued on June 24 for "LED light" (Chinese Inventor)

ALEXANDRIA, Va., June 25 -- United States Patent no. D1,080,958, issued on June 24. "LED light" was invented by QuanHua Mai (Zhongshan, China). The patent was filed on June 19, 2019, under Applicati... Read More