ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,473,539, issued on Nov. 18, was assigned to Life Edit Therapeutics Inc. (Durham, N.C.). "RNA-guided nucleases and active fragments and variants... Read More
ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,475,435, issued on Nov. 18, was assigned to Mitek Systems Inc. (San Diego). "Antenna alignment feedback using near field communication devices"... Read More
ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,474,903, issued on Nov. 18, was assigned to The Math Works Inc. (Natick, Mass.). "Systems and methods for automatically generating computer pro... Read More
ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,472,751, issued on Nov. 18, was assigned to Ricoh Co. Ltd. (Tokyo). "Printhead with internal pump at fluid manifold" was invented by Giang Vo (... Read More
ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,476,192, issued on Nov. 18, was assigned to Sandisk Technologies Inc. (Milpitas, Calif.). "Three-dimensional memory device including a drain co... Read More
ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,475,709, issued on Nov. 18, was assigned to MOTOROLA SOLUTIONS INC. (Chicago). "Crowd anomaly detection" was invented by Aleksey Lipchin (Newto... Read More
ALEXANDRIA, Va., Nov. 18 -- United States Patent no. D1,102,271, issued on Nov. 18, was assigned to Delta Electronics Inc. (Taoyuan, Taiwan). "Packaging tray" was invented by Hui-Wen Tsai (Taoyuan, T... Read More
ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,476,448, issued on Nov. 18, was assigned to AUTONETWORKS TECHNOLOGIES LTD. (Mie, Japan), SUMITOMO WIRING SYSTEMS LTD. (Mie, Japan) and SUMITOMO ... Read More
ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,477,360, issued on Nov. 18, was assigned to QUALCOMM Inc. (San Diego). "Techniques for primary sidelink carrier updating in sidelink carrier ag... Read More
ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,476,225, issued on Nov. 18, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Semiconductor package and method of fabricat... Read More