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INTERNATIONAL PATENT: ASAHI KASEI KABUSHIKI KAISHA, 旭化成株式会社 FILES APPLICATION FOR "COMPOSITION, EPOXY RESIN COMPOSITION, FILM, PRINTED WIRING BOARD, SEMICONDUCTOR CHIP PACKAGE AND ELECTRONIC DEVICE"

Posted On: 2025-05-18
Government News US Fed News

GENEVA, May 18 -- ASAHI KASEI KABUSHIKI KAISHA (1-1-2 Yurakucho, Chiyoda-ku, Tokyo1000006), 旭化成株式会社 (東京都千代田&#... Read More

INTERNATIONAL PATENT: MITSUBISHI HEAVY INDUSTRIES, LTD., 三菱重工業株式会社, MITSUBISHI POWER, LTD., 三菱パワー株式会社 FILES APPLICATION FOR "GAS TURBINE CONTROL DEVICE, GAS TURBINE CONTROL METHOD AND GAS TURBINE CONTROL PROGRAM"

Posted On: 2025-05-18
Government News US Fed News

GENEVA, May 18 -- MITSUBISHI HEAVY INDUSTRIES, LTD. (2-3, Marunouchi 3-Chome, Chiyoda-ku, Tokyo1008332), 三菱重工業株式会社 (東京&#371... Read More

INTERNATIONAL PATENT: NIPPON TANSHI CO., LTD., 日本端子株式会社 FILES APPLICATION FOR "CONNECTOR AND TERMINAL MEMBER"

Posted On: 2025-05-18
Government News US Fed News

GENEVA, May 18 -- NIPPON TANSHI CO., LTD. (26-7, Yaezakicho, Hiratsuka-shi, Kanagawa2540811), 日本端子株式会社 (神奈川県平... Read More

INTERNATIONAL PATENT: HITACHI HIGH-TECH CORPORATION, 株式会社日立ハイテク FILES APPLICATION FOR "BOARD SUPPORT STRUCTURE AND SPECIMEN TREATING DEVICE PROVIDED WITH SAME"

Posted On: 2025-05-18
Government News US Fed News

GENEVA, May 18 -- HITACHI HIGH-TECH CORPORATION (17-1, Toranomon 1-chome, Minato-ku, Tokyo1056409), 株式会社日立ハイテク (東京&#... Read More

INTERNATIONAL PATENT: SONY SEMICONDUCTOR SOLUTIONS CORPORATION, ソニーセミコンダクタソリューションズ株式会社 FILES APPLICATION FOR "COMMUNICATION APPARATUS, POSITIONING SYSTEM AND METHOD FOR CONTROLLING COMMUNICATION APPARATUS"

Posted On: 2025-05-18
Government News US Fed News

GENEVA, May 18 -- SONY SEMICONDUCTOR SOLUTIONS CORPORATION (4-14-1 Asahi-cho, Atsugi-shi, Kanagawa2430014), ソニーセミコンダクタソ&#12... Read More

INTERNATIONAL PATENT: NIKKISO EIKO CO., LTD., 日機装エイコー株式会社 FILES APPLICATION FOR "RECIPROCATING PUMP AND FLOW STATE MONITORING METHOD"

Posted On: 2025-05-18
Government News US Fed News

GENEVA, May 18 -- NIKKISO EIKO CO., LTD. (7-5, Chikumazawa Higashi, Miyoshimachi, Irumagun, Saitama3540046), 日機装エイコー株式会社 (&... Read More

INTERNATIONAL PATENT: NISSAN CHEMICAL CORPORATION, 日産化学株式会社 FILES APPLICATION FOR "ELECTRODE PERIPHERAL EMBEDDING MATERIAL, PRE-BAKED FILM OF ELECTRODE PERIPHERAL EMBEDDING MATERIAL, METHOD FOR PRODUCING PRE-BAKED FILM OF ELECTRODE PERIPHERAL EMBEDDING MATERIAL AND MICRO-LED DISPLAY ELEMENT"

Posted On: 2025-05-18
Government News US Fed News

GENEVA, May 18 -- NISSAN CHEMICAL CORPORATION (5-1, Nihonbashi 2-chome, Chuo-ku, Tokyo1036119), 日産化学株式会社 (東京都中&#2283... Read More

INTERNATIONAL PATENT: SONY GROUP CORPORATION, ソニーグループ株式会社 FILES APPLICATION FOR "SIGNAL PROCESSING DEVICE, DISPLAY SYSTEM AND ELECTRONIC APPARATUS"

Posted On: 2025-05-18
Government News US Fed News

GENEVA, May 18 -- SONY GROUP CORPORATION (1-7-1, Konan, Minato-ku, Tokyo1080075), ソニーグループ株式会社 (東京都&#28... Read More

INTERNATIONAL PATENT: HITACHI ASTEMO, LTD., 日立ＡＳＴＥＭＯ株式会社 FILES APPLICATION FOR "HOUSING ASSEMBLY AND METHOD FOR MANUFACTURING HOUSING ASSEMBLY"

Posted On: 2025-05-18
Government News US Fed News

GENEVA, May 18 -- HITACHI ASTEMO, LTD. (2520 Takaba, Hitachinaka-shi, Ibaraki3128503), 日立Ａｓｔｅｍｏ株式会社 (茨&#22478... Read More

INTERNATIONAL PATENT: KANEKA CORPORATION, 株式会社カネカ FILES APPLICATION FOR "POLYAMIDE ACID, POLYAMIDE ACID COMPOSITION, POLYIMIDE, POLYIMIDE FILM, LAMINATE, METHOD FOR PRODUCING LAMINATE AND ELECTRONIC DEVICE"

Posted On: 2025-05-18
Government News US Fed News

GENEVA, May 18 -- KANEKA CORPORATION (2-3-18, Nakanoshima, Kita-ku, Osaka-shi, Osaka5308288), 株式会社カネカ (大阪府大阪市... Read More