ALEXANDRIA, Va., June 19 -- United States Patent no. 12,329,992, issued on June 17, was assigned to Emory University (Atlanta) and The Scripps Research Institute (La Jolla, Calif.). "Ebola virus anti... Read More
ALEXANDRIA, Va., June 19 -- United States Patent no. 12,332,959, issued on June 17, was assigned to MOBIWORK LLC (Boca Raton, Fla.). "Mobile workforce workflow automation data structure" was invented... Read More
ALEXANDRIA, Va., June 19 -- United States Patent no. 12,335,247, issued on June 17, was assigned to BITCORP S.R.L. (Milan). "Method and corresponding telecommunication network for secure data transmi... Read More
ALEXANDRIA, Va., June 19 -- United States Patent no. 12,334,283, issued on June 17, was assigned to Siemens AG (Munich). "Fault detection in spring-loaded drives of medium-voltage switchgear systems"... Read More
ALEXANDRIA, Va., June 19 -- United States Patent no. 12,331,527, issued on June 17, was assigned to UNILIN BV (Wielsbeke, Belgium). "Panel and method for manufacturing such a panel" was invented by B... Read More
ALEXANDRIA, Va., June 19 -- United States Patent no. 12,332,301, issued on June 17, was assigned to Synopsys Inc. (Sunnyvale, Calif.). "Measuring device defect sensitization in transistor-level circu... Read More
ALEXANDRIA, Va., June 19 -- United States Patent no. 12,331,626, issued on June 17, was assigned to YANTAI JEREH PETROLEUM EQUIPMENT & TECHNOLOGIES Co. LTD. (Yantai, China). "Fracturing device driven... Read More
ALEXANDRIA, Va., June 19 -- United States Patent no. 12,335,521, issued on June 17, was assigned to Apple Inc. (Cupertino, Calif.). "In-tree geometry quantization of point clouds" was invented by Dav... Read More
ALEXANDRIA, Va., June 19 -- United States Patent no. 12,335,315, issued on June 17, was assigned to Dell Products LP (Round Rock, Texas). "Method and system for smart recommendation and dynamic group... Read More
ALEXANDRIA, Va., June 19 -- United States Patent no. 12,334,421, issued on June 17, was assigned to Navitas Semiconductor Ltd. (Dublin). "Thermally enhanced electronic packages for GaN power integrat... Read More