ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,431,648, issued on Sept. 30, was assigned to BRUGG ECONNECT AG (Brugg, Switzerland). "Connection element for electrically connecting a fluid-c... Read More
ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,429,411, issued on Sept. 30, was assigned to The Regents Of The University of California (Oakland, Calif.). "Method for characterizing and ide... Read More
ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,431,784, issued on Sept. 30, was assigned to Power Forest Technology Corp. (Hsinchu County, Taiwan). "Controller for power supply device" was ... Read More
ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,432,325, issued on Sept. 30, was assigned to Coretronic Corp. (Hsin-Chu, Taiwan). "Projection system and control method thereof" was invented ... Read More
ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,429,632, issued on Sept. 30, was assigned to SAMSUNG DISPLAY Co. LTD. (Yongin-si, South Korea). "Window and display device including same" was... Read More
ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,429,866, issued on Sept. 30, was assigned to Steering Solutions IP Holding Corp. (Saginaw, Mich.). "Remote sensor system" was invented by Mang... Read More
ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,432,172, issued on Sept. 30, was assigned to Verizon Patent and Licensing Inc. (Basking Ridge, N.J.). "Multi-level and dynamic timers for carr... Read More
ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,431,031, issued on Sept. 30, was assigned to Civil Aviation Flight University of China (Guanghan, China). "Method and device for predicting ca... Read More
ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,429,051, issued on Sept. 30, was assigned to PARALLOID GEAR Co. LTD. (Gimpo-si, South Korea). "Single screw compressor" was invented by In Hwa... Read More
ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,431,382, issued on Sept. 30, was assigned to GRAND PROCESS TECHNOLOGY Corp. (Hsinchu, Taiwan). "Integrated wafer debonding and cleaning appara... Read More