ALEXANDRIA, Va., June 16 -- United States Patent no. 12,305,562, issued on May 20, was assigned to DINEX A/S (Middelfart, Denmark). "Compact evaporation and mixing device" was invented by Toni Eero M... Read More
ALEXANDRIA, Va., June 16 -- United States Patent no. 12,308,621, issued on May 20, was assigned to AcLeap Power Inc. (Taipei, Taiwan). "Power distribution enclosure having a combined reconfigurable s... Read More
ALEXANDRIA, Va., June 16 -- United States Patent no. 12,302,905, issued on May 20, was assigned to Kavach Nanotechnologies Inc. (Fremont, Calif.). "Field-deployable antimicrobial product assemblies f... Read More
ALEXANDRIA, Va., June 16 -- United States Patent no. 12,306,860, issued on May 20, was assigned to Oracle International Corp. (Redwood Shores, Calif.). "Intelligently expanding search results ahead-o... Read More
ALEXANDRIA, Va., June 16 -- United States Patent no. 12,303,855, issued on May 20, was assigned to INTERNATIONAL FLAVORS & FRAGRANCES INC. (New York). "Stable polyurea microcapsule compositions for a... Read More
ALEXANDRIA, Va., June 16 -- United States Patent no. 12,310,093, issued on May 20, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Semiconductor device and manufacturi... Read More
ALEXANDRIA, Va., June 16 -- United States Patent no. 12,306,918, issued on May 20, was assigned to VERITONE INC. (Irvine, Calif.). "Cognitive multi-factor authentication" was invented by Chad Steelbe... Read More
ALEXANDRIA, Va., June 16 -- United States Patent no. 12,304,157, issued on May 20, was assigned to TSI Technologies LLC (Wichita, Kan.). "In-situ monitoring and control of induction welding of thermo... Read More
ALEXANDRIA, Va., June 16 -- United States Patent no. 12,308,147, issued on May 20, was assigned to YAGEO Corp. (Kaohsiung, Taiwan). "Thermistor paste and manufacturing method thereof" was invented by... Read More
ALEXANDRIA, Va., June 16 -- United States Patent no. 12,306,376, issued on May 20, was assigned to HEFEI XINSHENG OPTOELECTRONICS TECHNOLOGY Co. LTD. (Hefei, China) and BOE TECHNOLOGY GROUP Co. LTD. (... Read More