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INTERNATIONAL PATENT: NIPPON ELECTRIC GLASS CO., LTD., 日本電気硝子株式会社 FILES APPLICATION FOR "INORGANIC PLATE WITH FILM AND PACKAGE"

Posted On: 2025-04-28
Government News US Fed News

GENEVA, April 28 -- NIPPON ELECTRIC GLASS CO., LTD. (7-1, Seiran 2-chome, Otsu-shi, Shiga5208639), 日本電気硝子株式会社 (滋賀&#3... Read More

INTERNATIONAL PATENT: NSK LTD., 日本精工株式会社 FILES APPLICATION FOR "REDUCTION GEAR"

Posted On: 2025-04-28
Government News US Fed News

GENEVA, April 28 -- NSK LTD. (6-3, Ohsaki 1-chome, Shinagawa-ku, Tokyo1418560), 日本精工株式会社 (東京都品川区&#2282... Read More

INTERNATIONAL PATENT: SONY SEMICONDUCTOR SOLUTIONS CORPORATION, ソニーセミコンダクタソリューションズ株式会社 FILES APPLICATION FOR "IMAGE PROCESSING DEVICE, IMAGE PROCESSING METHOD AND IMAGE PROCESSING PROGRAM"

Posted On: 2025-04-28
Government News US Fed News

GENEVA, April 28 -- SONY SEMICONDUCTOR SOLUTIONS CORPORATION (4-14-1, Asahi-cho, Atsugi-shi, Kanagawa2430014), ソニーセミコンダクタソ&... Read More

INTERNATIONAL PATENT: HITACHI, LTD., 株式会社日立製作所 FILES APPLICATION FOR "SPACE GENERATION DEVICE, SPACE GENERATION METHOD AND SPACE GENERATION PROGRAM"

Posted On: 2025-04-28
Government News US Fed News

GENEVA, April 28 -- HITACHI, LTD. (6-6, Marunouchi 1-chome, Chiyoda-ku, Tokyo1008280), 株式会社日立製作所 (東京都千&#20195... Read More

INTERNATIONAL PATENT: SHIMADZU CORPORATION, 株式会社島津製作所 FILES APPLICATION FOR "DATA PROCESSING METHOD, ANALYSIS SYSTEM AND PROGRAM"

Posted On: 2025-04-28
Government News US Fed News

GENEVA, April 28 -- SHIMADZU CORPORATION (1, Nishinokyo Kuwabara-cho, Nakagyo-ku, Kyoto-shi, Kyoto6048511), 株式会社島津製作所 (京都&#... Read More

INTERNATIONAL PATENT: TOYO SEIKAN CO.,LTD., 東洋製罐株式会社 FILES APPLICATION FOR "POUCH FOR MICROWAVE OVENS AND FILLED POUCH FOR MICROWAVE OVENS"

Posted On: 2025-04-28
Government News US Fed News

GENEVA, April 28 -- TOYO SEIKAN CO.,LTD. (18-1, Higashi-Gotanda 2-chome, Shinagawa-ku, Tokyo1418640), 東洋製罐株式会社 (東京都品... Read More

INTERNATIONAL PATENT: TEIJIN LIMITED, 帝人株式会社 FILES APPLICATION FOR "REINFORCING MATERIAL FOR HYDRATED AND SOLIDIFIED BODIES AND HYDRATED AND SOLIDIFIED BODY"

Posted On: 2025-04-28
Government News US Fed News

GENEVA, April 28 -- TEIJIN LIMITED (2-4, Nakanoshima 3-chome, Kita-ku, Osaka-shi Osaka5300005), 帝人株式会社 (大阪府大阪市&#2127... Read More

INTERNATIONAL PATENT: DENKA COMPANY LIMITED, デンカ株式会社 FILES APPLICATION FOR "ENCAPSULATING COMPOSITION, CURED OBJECT, DISPLAY DEVICE AND SOLAR CELL"

Posted On: 2025-04-28
Government News US Fed News

GENEVA, April 28 -- DENKA COMPANY LIMITED (1-1, Nihonbashi-Muromachi 2-chome, Chuo-ku, Tokyo1038338), デンカ株式会社 (東京都中央... Read More

INTERNATIONAL PATENT: AUTONETWORKS TECHNOLOGIES, LTD., 株式会社オートネットワーク技術研究所, SUMITOMO WIRING SYSTEMS, LTD., 住友電装株式会社, SUMITOMO ELECTRIC INDUSTRIES, LTD., 住友電気工業株式会社 FILES APPLICATION FOR "ELECTRIC JUNCTION BOX"

Posted On: 2025-04-28
Government News US Fed News

GENEVA, April 28 -- AUTONETWORKS TECHNOLOGIES, LTD. (1-14, Nishisuehiro-cho, Yokkaichi-shi, Mie5108503), 株式会社オートネットワ&#12540... Read More

INTERNATIONAL PATENT: MITSUBISHI HEAVY INDUSTRIES THERMAL SYSTEMS, LTD., 三菱重工サーマルシステムズ株式会社 FILES APPLICATION FOR "AIR CONDITIONING SYSTEM, AIR CONDITIONING SYSTEM CONTROL METHOD AND PROGRAM"

Posted On: 2025-04-28
Government News US Fed News

GENEVA, April 28 -- MITSUBISHI HEAVY INDUSTRIES THERMAL SYSTEMS, LTD. (2-3, Marunouchi 3-Chome, Chiyoda-ku, Tokyo1008332), 三菱重工サーマルシ&#124... Read More