Japan, Oct. 30 -- HOYA CORP has got intellectual property rights for 'PROCESSOR FOR ELECTRONIC ENDOSCOPE AND ELECTRONIC ENDOSCOPE SYSTEM.' Other related details are as follows: Application Number: JP... Read More
Japan, Oct. 30 -- TOKYO ELECTRON LTD has got intellectual property rights for 'ETCHING METHOD AND PLASMA PROCESSING APPARATUS.' Other related details are as follows: Application Number: JP,2022-13437... Read More
Japan, Oct. 30 -- TOSHIBA CORP,TOSHIBA ELECTRONIC DEVICES & STORAGE CORP has got intellectual property rights for 'SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME.' Other related details ar... Read More
Japan, Oct. 30 -- MATATAKITOYO TOOL CO LTD has got intellectual property rights for 'DETECTOR FOR DETECTING TORQUE OF POWER TOOL.' Other related details are as follows: Application Number: JP,2023-09... Read More
Japan, Oct. 30 -- NCHAIN LICENSING AG has got intellectual property rights for 'COMPUTER-IMPLEMENTED SYSTEM AND METHOD FOR TRANSFERRING ACCESS TO DIGITAL RESOURCE.' Other related details are as follow... Read More
Japan, Oct. 30 -- TERUMO CORP has got intellectual property rights for 'CONTAINER AND KIT FOR PREPARING CELL CULTURE IN SPACE OF HIGH CLEANLINESS.' Other related details are as follows: Application N... Read More
Japan, Oct. 30 -- ISHIGAKI CO LTD has got intellectual property rights for 'FILTER CLOTH BREAKAGE DETECTION DEVICE FOR FILTER PRESS.' Other related details are as follows: Application Number: JP,2022... Read More
Japan, Oct. 30 -- RAYNERGY TEK INC has got intellectual property rights for 'ORGANIC SEMICONDUCTOR POLYMERS AND ORGANIC OPTOELECTRONIC DEVICES CONTAINING THEM.' Other related details are as follows: ... Read More
Japan, Oct. 30 -- SANEI R & D CO LTD has got intellectual property rights for 'GAME MACHINE.' Other related details are as follows: Application Number: JP,2024-004763 Category (FI): A63F7/02,326@Z,A... Read More
Japan, Oct. 30 -- DEXCOM INC has got intellectual property rights for 'ENZYME IMMOBILIZED ADHESIVE LAYER FOR ANALYTE SENSORS.' Other related details are as follows: Application Number: JP,2023-210269... Read More