Japan, Jan. 27 -- NISSHINBO MICRO DEVICES INC has got intellectual property rights for 'SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME.' Other related details are as follows: Application ... Read More
Japan, Jan. 27 -- SPIN SENSING FACTORY CO LTD has got intellectual property rights for 'MAGNETIC SENSOR.' Other related details are as follows: Application Number: JP,2022-033515 Category (FI): G01R... Read More
Japan, Jan. 27 -- SAMSUNG ELECTRONICS CO LTD has got intellectual property rights for 'RESIN COMPONENT FOR REFRIGERATOR.' Other related details are as follows: Application Number: JP,2022-033503 Cat... Read More
Japan, Jan. 27 -- TERUMO CORP has got intellectual property rights for 'COLLECTION KIT.' Other related details are as follows: Application Number: JP,2022-031842 Category (FI): G01N1/10@V,G01N1/00,1... Read More
Japan, Jan. 27 -- TERUMO CORP has got intellectual property rights for 'COLLECTION KIT.' Other related details are as follows: Application Number: JP,2022-031835 Category (FI): G01N1/00,101@K,G01N1/... Read More
Japan, Jan. 27 -- TOHOKU SHIZAI KOGYO KK,IWATE UNIV has got intellectual property rights for 'MOLDING DEVICE AND CONTROL METHOD.' Other related details are as follows: Application Number: JP,2022-030... Read More
Japan, Jan. 27 -- DGSHAPE CO LTD has got intellectual property rights for 'CUTTING MACHINE.' Other related details are as follows: Application Number: JP,2022-029437 Category (FI): A61C1/00,A61C1/00... Read More
Japan, Jan. 27 -- TOSHIBA CORP,TOSHIBA MATERIALS CO LTD has got intellectual property rights for 'CERAMIC SEALING COMPONENT AND MANUFACTURING METHOD THEREOF.' Other related details are as follows: Ap... Read More
Japan, Jan. 27 -- MITSUBISHI HEAVY IND LTD has got intellectual property rights for 'PROTECTIVE DEVICE, PULVERIZER, AND METHOD FOR REMOVING PROTECTIVE DEVICE.' Other related details are as follows: A... Read More
Japan, Jan. 27 -- AZBIL CORP has got intellectual property rights for 'PROXIMITY SWITCH AND METHOD FOR MANUFACTURING THE SAME.' Other related details are as follows: Application Number: JP,2022-02648... Read More