MUMBAI, India, Feb. 21 -- Intellectual Property India has published a patent application (202311054486 A) filed by Nokia Technologies Oy, Espoo, Finland, on Aug. 14, 2023, for 'non-3gpp access authent... Read More
MUMBAI, India, Feb. 21 -- Intellectual Property India has published a patent application (202517001400 A) filed by Google Llc, Mountain View, U.S.A., on Jan. 7, for 'generation of multi-dimensional co... Read More
MUMBAI, India, Feb. 21 -- Intellectual Property India has published a patent application (202517006973 A) filed by Huawei Technologies Co. Ltd., Guangdong, China, on Jan. 28, for 'communication method... Read More
MUMBAI, India, Feb. 21 -- Intellectual Property India has published a patent application (202517006690 A) filed by Shindengen Electric Manufacturing Co. Ltd., Tokyo, on Jan. 27, for 'battery charging ... Read More
MUMBAI, India, Feb. 21 -- Intellectual Property India has published a patent application (202341054546 A) filed by Ms. B. A. Keerthana; Mr. J. Dharaneesh; Mr. A. Jai Krishnan; Ms. R. Adharshna; Mr. P.... Read More
MUMBAI, India, Feb. 21 -- Intellectual Property India has published a patent application (202517001967 A) filed by Abiomed, Inc., Danvers, U.S.A., on Jan. 9, for 'flexible outflow cannula with shaped ... Read More
MUMBAI, India, Feb. 21 -- Intellectual Property India has published a patent application (202517001359 A) filed by Newtech Textile Technology Development (SHANGHAI) Co. Ltd., Shanghai, on Jan. 7, for ... Read More
MUMBAI, India, Feb. 21 -- Intellectual Property India has published a patent application (202517006965 A) filed by Innomotics Gmbh, Nurnberg, Germany, on Jan. 28, for 'smart modules for a top-mounted ... Read More
MUMBAI, India, Feb. 21 -- Intellectual Property India has published a patent application (202517006689 A) filed by Spreadtrum Communications (SHANGHAI) Co. Ltd., Shanghai, on Jan. 27, for 'paging resp... Read More
MUMBAI, India, Feb. 21 -- Intellectual Property India has published a patent application (202517001163 A) filed by Jfe Steel Corporation, Tokyo, on Jan. 6, for 'seeding machine and seeding method.' I... Read More