Japan, Jan. 28 -- HITACHI LTD has got intellectual property rights for 'DESIGN EXECUTION DEVICE, DESIGN EXECUTION SYSTEM, AND DESIGN EXECUTION METHOD.' Other related details are as follows: Applicati... Read More
Japan, Jan. 28 -- CANON MEDICAL SYSTEMS CORP has got intellectual property rights for 'METHOD FOR DETECTING OR QUANTIFYING DETECTION OBJECT IN SAMPLE, AND REAGENT FOR DETECTING OR QUANTIFYING DETECTIO... Read More
Japan, Jan. 28 -- NIPPON SHOKUBAI CO LTD has got intellectual property rights for 'RADICALLY POLYMERIZABLE POLYMER AND PHOTOSENSITIVE COMPOSITION.' Other related details are as follows: Application N... Read More
Japan, Jan. 28 -- NISSHIN OILLIO GROUP LTD has got intellectual property rights for 'OIL COMPOSITION FOR COOKING RICE FOOD, RICE FOOD, AND PRODUCTION METHOD OF RICE FOOD.' Other related details are as... Read More
Japan, Jan. 28 -- PIONEER ELECTRONIC CORP has got intellectual property rights for 'INFORMATION PROCESSING DEVICE AND RECOMMENDED SIGHT LINE DIRECTION ACQUISITION METHOD.' Other related details are as... Read More
Japan, Jan. 28 -- EBARA CORP has got intellectual property rights for 'IMPELLER AND PUMP.' Other related details are as follows: Application Number: JP,2021-166566 Category (FI): F04D29/043@Z,F04D29... Read More
Japan, Jan. 28 -- ENERES CORP has got intellectual property rights for 'GENERATION SYSTEM, GENERATION METHOD AND GENERATION PROGRAM FOR ENVIRONMENTAL VALUE DIGITAL ART.' Other related details are as f... Read More
Japan, Jan. 28 -- BASF SE has got intellectual property rights for 'PROCESS FOR PREPARING MOLDING COMPRISING ZINC AND TITANIUM-CONTAINING ZEOLITE.' Other related details are as follows: Application N... Read More
Japan, Jan. 28 -- SATAKE MULTIMIX CORP has got intellectual property rights for 'CENTRIFUGAL THICKENER.' Other related details are as follows: Application Number: JP,2021-164632 Category (FI): B04B1... Read More
Japan, Jan. 28 -- MITSUBISHI ELECTRIC CORP has got intellectual property rights for 'SEMICONDUCTOR DEVICE SUBSTRATE, MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE SUBSTRATE AND JOINT MATERIAL.' Other r... Read More