ALEXANDRIA, Va., Feb. 5 -- United States Patent no. 12,214,759, issued on Feb. 4, was assigned to HYUNDAI MOTOR COMPANY (Seoul, South Korea) and KIA Corp. (Seoul, South Korea). "Compressor cooling sy... Read More
ALEXANDRIA, Va., Feb. 5 -- United States Patent no. 12,218,591, issued on Feb. 4, was assigned to Richtek Technology Corp. (Hsinchu, Taiwan). "Switching power converter and conversion control circuit... Read More
ALEXANDRIA, Va., Feb. 5 -- United States Patent no. 12,219,266, issued on Feb. 4, was assigned to NIKON Corp. (Tokyo). "Electronic device, imaging device, and imaging element for capturing an image" ... Read More
ALEXANDRIA, Va., Feb. 5 -- United States Patent no. 12,217,257, issued on Feb. 4, was assigned to NCHAIN LICENSING AG (Zug, Switzerland). "Trustless deterministic state machine" was invented by Ying ... Read More
ALEXANDRIA, Va., Feb. 5 -- United States Patent no. 12,213,848, issued on Feb. 4, was assigned to NORIS MEDICAL LTD. (Nesher, Israel). "Surgical guide for zygomatic bone implants" was invented by Fra... Read More
ALEXANDRIA, Va., Feb. 5 -- United States Patent no. 12,214,969, issued on Feb. 4, was assigned to INTELLIGRATED HEADQUARTERS LLC (Mason, Ohio). "Speed control system for peripheral conveyors of sorte... Read More
ALEXANDRIA, Va., Feb. 5 -- United States Patent no. 12,217,530, issued on Feb. 4, was assigned to QUALCOMM Inc. (San Diego). "Under-display ultrasonic fingerprint sensors for foldable displays" was i... Read More
ALEXANDRIA, Va., Feb. 5 -- United States Patent no. D1,060,212, issued on Feb. 4, was assigned to Techtronic Cordless GP (Anderson, S.C.). "Battery pack" was invented by Nataraj Chandrasekharan (Ande... Read More
ALEXANDRIA, Va., Feb. 5 -- United States Patent no. 12,215,516, issued on Feb. 4. "Curtain assembly and assembling method thereof" was invented by Guangtian Wang (Hacienda Heights, Calif.). Accordin... Read More
ALEXANDRIA, Va., Feb. 5 -- United States Patent no. 12,216,611, issued on Feb. 4, was assigned to Shenzhen Corerain Technologies Co. Ltd. (Shenzhen, China). "Artificial intelligence chip and artifici... Read More