Japan, Feb. 12 -- SEIKO EPSON CORP has got intellectual property rights for 'LIGHT SOURCE DEVICE AND PROJECTOR.' Other related details are as follows: Application Number: JP,2024-207161 Category (FI... Read More
Japan, Feb. 12 -- SUMITOMO ELECTRIC IND LTD has got intellectual property rights for 'OPTICAL DEVICE.' Other related details are as follows: Application Number: JP,2024-210954 Category (FI): G02B6/4... Read More
Japan, Feb. 12 -- HUAWEI TECHNOLOGIES CO LTD has got intellectual property rights for 'METHOD AND DEVICE FOR SIGNALING NUMBER OF CANDIDATES FOR MERGE MODE.' Other related details are as follows: Appl... Read More
Japan, Feb. 12 -- KAJIMA CORP has got intellectual property rights for 'LEACHATE WATER-COLLECTION PIT, WASTE DISPOSAL FACILITY, AND METHOD OF CONSTRUCTING LEACHATE WATER-COLLECTION PIT.' Other related... Read More
Japan, Feb. 12 -- RICOH CO LTD has got intellectual property rights for 'INFORMATION MANAGEMENT SYSTEM, INFORMATION PROCESSING APPARATUS, PROGRAM, AND METHOD FOR MAKING USE OF QUESTIONNAIRE.' Other re... Read More
Japan, Feb. 12 -- TOYOBO CO LTD has got intellectual property rights for 'LAMINATED FILM.' Other related details are as follows: Application Number: JP,2024-220249 Category (FI): B32B27/32@E,B32B27/... Read More
Japan, Feb. 12 -- ISEKI & CO LTD has got intellectual property rights for 'SULKY SEEDLING PLANTING MACHINE.' Other related details are as follows: Application Number: JP,2024-218135 Category (FI): A... Read More
Japan, Feb. 12 -- STANLEY ELECTRIC CO LTD has got intellectual property rights for 'LIGHT DEFLECTOR DRIVING SYSTEM, AND LIGHT DEFLECTOR DRIVING METHOD.' Other related details are as follows: Applicat... Read More
Japan, Feb. 12 -- JFE STEEL CORP has got intellectual property rights for 'SURFACE TREATMENT METHOD FOR STEEL SHEET, PRODUCTION METHOD FOR STEEL SHEET, AND MANUFACTURING METHOD FOR PRESS MOLDED ARTICL... Read More
Japan, Feb. 12 -- SONY GROUP CORP has got intellectual property rights for 'INFORMATION PROCESSING DEVICE AND METHOD, AND PROGRAM.' Other related details are as follows: Application Number: JP,2024-2... Read More