ALEXANDRIA, Va., March 26 -- United States Patent no. 12,259,373, issued on March 25, was assigned to Regeneron Pharmaceuticals Inc. (Tarrytown, N.Y.). "High confidence compound identification by liq... Read More
ALEXANDRIA, Va., March 26 -- United States Patent no. 12,257,369, issued on March 25, was assigned to Hollister Inc. (Libertyville, Ill.). "Catheter assemblies with interfacial pH controller" was inv... Read More
ALEXANDRIA, Va., March 26 -- United States Patent no. 12,262,586, issued on March 25, was assigned to Innolux Corp. (Miao-Li County, Taiwan). "Electronic device" was invented by Irene Wu (Miao-Li Cou... Read More
ALEXANDRIA, Va., March 26 -- United States Patent no. 12,262,462, issued on March 25, was assigned to Wisconsin Alumni Research Foundation (Madison, Wis.). "High-energy plasma generator using radio-f... Read More
ALEXANDRIA, Va., March 26 -- United States Patent no. 12,261,383, issued on March 25, was assigned to Japan Aviation Electronics Industry Ltd. (Tokyo). "Socket connector" was invented by Takashi Omod... Read More
ALEXANDRIA, Va., March 26 -- United States Patent no. 12,257,161, issued on March 25. "Interbody device with rotating blade" was invented by Bret Michael Berry (Tallahassee, Fla.). According to the ... Read More
ALEXANDRIA, Va., March 26 -- United States Patent no. 12,259,194, issued on March 25, was assigned to General Electric Co. (Evendale, Ohio). "Thermal management system" was invented by Michael Simone... Read More
ALEXANDRIA, Va., March 26 -- United States Patent no. 12,260,188, issued on March 25, was assigned to KOREA ELECTRONICS TECHNOLOGY INSTITUTE (Seongnam-si, South Korea). "Pop count-based deep learning... Read More
ALEXANDRIA, Va., March 26 -- United States Patent no. 12,257,962, issued on March 25, was assigned to Lear Corp. (Southfield, Mich.). "Electrical assembly" was invented by Peter Kowtun (Plymouth, Mic... Read More
ALEXANDRIA, Va., March 26 -- United States Patent no. 12,261,157, issued on March 25, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor device having package on pac... Read More