ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,428,430, issued on Sept. 30, was assigned to Bristol-Myers Squibb Co. (Princeton, N.J.). "Oxabicyclo acids as LPA antagonists" was invented by... Read More
ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,428,217, issued on Sept. 30, was assigned to GOGLIO S.p.A. (Milan). "Capsules for soluble or extractable products" was invented by Osvaldo Bos... Read More
ALEXANDRIA, Va., Sept. 30 -- United States Patent no. D1,095,046, issued on Sept. 30, was assigned to Shenzhen Shengtong Weiye Technology Co. Ltd. (Shenzhen, China). "Hair remover" was invented by Ya... Read More
ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,427,310, issued on Sept. 30, was assigned to THERANICA BIO-ELECTRONICS LTD. (Netanya, Israel). "Application of an electrical amplitude-modulat... Read More
ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,427,838, issued on Sept. 30, was assigned to Valeo Systemes Thermiques (La Verriere, France). "Thermal conditioning system" was invented by Mo... Read More
ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,427,015, issued on Sept. 30, was assigned to Trisol Medical Ltd. (Yokneam, Israel). "Prosthetic valve and deployment system" was invented by M... Read More
ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,427,849, issued on Sept. 30, was assigned to NIDEC Corp. (Kyoto, Japan) and Nidec Taiwan Corp. (Taipei, Taiwan). "Driver of automatic guided v... Read More
ALEXANDRIA, Va., Sept. 30 -- United States Patent no. D1,095,308, issued on Sept. 30, was assigned to Harry Winston SA (Plan-les-Ouates, Switzerland). "Ring" was invented by Rie Yatsugi-Kang (New Yor... Read More
ALEXANDRIA, Va., Sept. 30 -- United States Patent no. D1,095,491, issued on Sept. 30, was assigned to ODM GMBH (Wattenheim, Germany). "Headphone" was invented by Christopher Kuhn (Obrigheim, Germany)... Read More
ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,428,293, issued on Sept. 30, was assigned to Merry Electronics(Shenzhen) Co. Ltd. (ShenZhen, China). "Micro-electromechanical packaging struct... Read More