ALEXANDRIA, Va., June 10 -- United States Patent no. 12,293,145, issued on May 6, was assigned to Google LLC (Mountain View, Calif.). "Integration of content in non-browser applications" was invented... Read More
ALEXANDRIA, Va., June 10 -- United States Patent no. 12,291,719, issued on May 6, was assigned to University of Massachusetts (Westborough, Mass.). "Heterologous targeting peptide grafted AAVs" was i... Read More
ALEXANDRIA, Va., June 10 -- United States Patent no. RE50,420, issued on May 6, was assigned to NetScout Sytems Inc. (Westford, Mass.). "System and method for identifying OTT applications and service... Read More
ALEXANDRIA, Va., June 10 -- United States Patent no. 12,290,743, issued on May 6. "Ice and snow dual-purpose sliding device" was invented by Changcheng Ming (Shenzhen, China). According to the abstr... Read More
ALEXANDRIA, Va., June 10 -- United States Patent no. 12,294,861, issued on May 6, was assigned to AT&T Intellectual Property I LP (Atlanta). "Phantom call reduction for cellular networks" was invente... Read More
ALEXANDRIA, Va., June 10 -- United States Patent no. 12,291,908, issued on May 6, was assigned to NINGBO GEELY AUTOMOBILE RESEARCH & DEV. Co. LTD. (Ningbo, China) and ZHEJIANG GEELY HOLDING GROUP Co. ... Read More
ALEXANDRIA, Va., June 10 -- United States Patent no. 12,291,694, issued on May 6, was assigned to Melina Kalagasidis Krusic (Belgrade, Serbia). "Dye scavenger and method of production of dye scavenge... Read More
ALEXANDRIA, Va., June 10 -- United States Patent no. D1,073,620, issued on May 6. "Socket" was invented by Yingzhi Jia (Zhumadian, China). The patent was filed on Aug. 21, 2023, under Application No... Read More
ALEXANDRIA, Va., June 10 -- United States Patent no. 12,293,439, issued on May 6, was assigned to Dell Products LP (Round Rock, Texas). "Method, electronic device, and computer program product for im... Read More
ALEXANDRIA, Va., June 10 -- United States Patent no. 12,293,982, issued on May 6, was assigned to NANYA TECHNOLOGY Corp. (New Taipei, Taiwan). "Semiconductor structure having hybrid bonding pad" was ... Read More