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INTERNATIONAL PATENT: HITACHI HIGH-TECH CORPORATION, 株式会社日立ハイテク FILES APPLICATION FOR "DEFECTIVE POINT ESTIMATION METHOD AND LIQUID CHROMATOGRAPH"

Posted On: 2025-02-17
Government News US Fed News

GENEVA, Feb. 17 -- HITACHI HIGH-TECH CORPORATION (17-1, Toranomon 1-chome, Minato-ku, Tokyo1056409), 株式会社日立ハイテク (東京&... Read More

INTERNATIONAL PATENT: FOTOGRAPHER AI, INC., ＦＯＴＯＧＲＡＰＨＥＲ　ＡＩ株式会社 FILES APPLICATION FOR "GENERATION SUPPORT DEVICE, GENERATION SUPPORT PROGRAM AND GENERATION SUPPORT METHOD"

Posted On: 2025-02-17
Government News US Fed News

GENEVA, Feb. 17 -- FOTOGRAPHER AI, INC. (5th Floor ST Building, 1-10-9 Higashi-Gotanda, Shinagawa-ku, Tokyo1410022), Ｆｏｔｏｇｒａｐｈｅ&#6... Read More

INTERNATIONAL PATENT: SONY SEMICONDUCTOR SOLUTIONS CORPORATION, ソニーセミコンダクタソリューションズ株式会社 FILES APPLICATION FOR "SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SAME"

Posted On: 2025-02-17
Government News US Fed News

GENEVA, Feb. 17 -- SONY SEMICONDUCTOR SOLUTIONS CORPORATION (4-14-1 Asahicho, Atsugi-shi, Kanagawa2430014), ソニーセミコンダクタソ&#12... Read More

INTERNATIONAL PATENT: JSR CORPORATION, ＪＳＲ株式会社 FILES APPLICATION FOR "RADIATION-SENSITIVE COMPOSITION, RESIST PATTERN FORMATION METHOD AND POLYMER"

Posted On: 2025-02-17
Government News US Fed News

GENEVA, Feb. 17 -- JSR CORPORATION (9-2, Higashi-Shinbashi 1-chome, Minato-ku, Tokyo1058640), ＪＳＲ株式会社 (東京都港区東... Read More

INTERNATIONAL PATENT: DIC CORPORATION, ＤＩＣ株式会社 FILES APPLICATION FOR "THERMOSETTING ADHESIVE SHEET AND PRINTED WIRING BOARD"

Posted On: 2025-02-17
Government News US Fed News

GENEVA, Feb. 17 -- DIC CORPORATION (35-58, Sakashita 3-chome, Itabashi-ku, Tokyo1748520), ＤＩＣ株式会社 (東京都板橋区&#22... Read More

INTERNATIONAL PATENT: SONY GROUP CORPORATION, ソニーグループ株式会社 FILES APPLICATION FOR "INFORMATION PROCESSING DEVICE, INFORMATION PROCESSING METHOD AND COMPUTER-READABLE RECORDING MEDIUM"

Posted On: 2025-02-17
Government News US Fed News

GENEVA, Feb. 17 -- SONY GROUP CORPORATION (1-7-1 Konan, Minato-ku, Tokyo1080075), ソニーグループ株式会社 (東京都&#28... Read More

INTERNATIONAL PATENT: DIC CORPORATION, ＤＩＣ株式会社 FILES APPLICATION FOR "THERMOSETTING ADHESIVE SHEET AND PRINTED WIRING BOARD"

Posted On: 2025-02-17
Government News US Fed News

GENEVA, Feb. 17 -- DIC CORPORATION (35-58, Sakashita 3-chome, Itabashi-ku, Tokyo1748520), ＤＩＣ株式会社 (東京都板橋区&#22... Read More

INTERNATIONAL PATENT: MITSUBISHI HEAVY INDUSTRIES MACHINERY SYSTEMS, LTD., 三菱重工機械システム株式会社 FILES APPLICATION FOR "LEARNING IMAGE GENERATION METHOD, LEARNING IMAGE GENERATION DEVICE, LEARNING IMAGE GENERATION PROGRAM AND LEARNING MODEL GENERATION METHOD"

Posted On: 2025-02-17
Government News US Fed News

GENEVA, Feb. 17 -- MITSUBISHI HEAVY INDUSTRIES MACHINERY SYSTEMS, LTD. (1-1, Wadasaki-cho 1-chome, Hyogo-ku, Kobe-shi, Hyogo6528585), 三菱重工機械シス&#... Read More

INTERNATIONAL PATENT: MURATA MANUFACTURING CO., LTD., 株式会社村田製作所 FILES APPLICATION FOR "MULTILAYER CERAMIC CAPACITOR"

Posted On: 2025-02-17
Government News US Fed News

GENEVA, Feb. 17 -- MURATA MANUFACTURING CO., LTD. (10-1, Higashikotari 1-chome, Nagaokakyo-shi, Kyoto6178555), 株式会社村田製作所 (京&#37117... Read More

INTERNATIONAL PATENT: DAIKIN INDUSTRIES, LTD., ダイキン工業株式会社 FILES APPLICATION FOR "FAN, AIR CONDITIONING OUTDOOR UNIT AND AIR CONDITIONING DEVICE"

Posted On: 2025-02-17
Government News US Fed News

GENEVA, Feb. 17 -- DAIKIN INDUSTRIES, LTD. (Osaka Umeda Twin Towers South, 1-13-1, Umeda, Kita-ku, Osaka-shi, Osaka5300001), ダイキン工業株式会&#3... Read More