ALEXANDRIA, Va., Aug. 20 -- United States Patent no. 12,394,089, issued on Aug. 19, was assigned to NAVER Corp. (Gyeonggi-Do, South Korea). "Pose estimation systems and methods trained using motion c... Read More
ALEXANDRIA, Va., Aug. 20 -- United States Patent no. 12,390,064, issued on Aug. 19, was assigned to SharkNinja Operating LLC (Needham, Mass.). "Cleaning apparatus with combing unit for removing debri... Read More
ALEXANDRIA, Va., Aug. 20 -- United States Patent no. 12,391,000, issued on Aug. 19, was assigned to Honeywell Federal Manufacturing & Technologies LLC (Kansas City, Mo.). "System and method for creat... Read More
ALEXANDRIA, Va., Aug. 20 -- United States Patent no. 12,389,902, issued on Aug. 19, was assigned to THE CLEVELAND CLINIC FOUNDATION (Cleveland). "Device for support of an organ ex vivo and method usi... Read More
ALEXANDRIA, Va., Aug. 20 -- United States Patent no. 12,390,187, issued on Aug. 19, was assigned to California Institute of Technology (Pasadena, Calif.). "Measurement device" was invented by Alaina ... Read More
ALEXANDRIA, Va., Aug. 20 -- United States Patent no. 12,395,420, issued on Aug. 19, was assigned to Symetrix Inc. (Mountlake Terrace, Wash.). "Systems and methods for digital signal processing" was i... Read More
ALEXANDRIA, Va., Aug. 20 -- United States Patent no. 12,392,434, issued on Aug. 19, was assigned to Atomic Design Inc. (Lititz, Pa.). "Locking connector assembly" was invented by Josef W. Oggier III ... Read More
ALEXANDRIA, Va., Aug. 20 -- United States Patent no. 12,393,433, issued on Aug. 19, was assigned to Celligence International LLC (Guaynabo, Puerto Rico). "Method and computing apparatus for operating... Read More
ALEXANDRIA, Va., Aug. 20 -- United States Patent no. 12,396,212, issued on Aug. 19, was assigned to International Business Machines Corp. (Armonk, N.Y.). "Gate all-around device with through-stack na... Read More
ALEXANDRIA, Va., Aug. 20 -- United States Patent no. 12,394,641, issued on Aug. 19, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Molding apparatus of semiconductor package" ... Read More