ALEXANDRIA, Va., Feb. 19 -- United States Patent no. D1,062,194, issued on Feb. 18, was assigned to NIKE Inc. (Beaverton, Ore.). "Shoe" was invented by Edwin Cruz (Beaverton, Ore.). The patent was f... Read More
ALEXANDRIA, Va., Feb. 19 -- United States Patent no. 12,231,527, issued on Feb. 18, was assigned to TEXAS INSTRUMENTS Inc. (Dallas). "Clock recovery training" was invented by Bhavesh Bhakta (Richards... Read More
ALEXANDRIA, Va., Feb. 19 -- United States Patent no. 12,228,380, issued on Feb. 18, was assigned to PEARSON ENGINEERING Ltd. (Newcastle upon Tyne, Great Britain). "Mine clearance" was invented by Jon... Read More
ALEXANDRIA, Va., Feb. 19 -- United States Patent no. 12,227,828, issued on Feb. 18, was assigned to National University Corporation Nagaoka University of Technology (Nagaoka, Japan), WASEDA UNIVERSITY... Read More
ALEXANDRIA, Va., Feb. 19 -- United States Patent no. 12,228,474, issued on Feb. 18, was assigned to AISAN KOGYO K.K. (Obu, Japan). "Leakage detector" was invented by Yuya Tanida (Obu, Japan). Accord... Read More
ALEXANDRIA, Va., Feb. 19 -- United States Patent no. D1,063,215, issued on Feb. 18. "Dental floss holder" was invented by Giles William Onley Edwards (Gloucestershire, Great Britain). The patent was... Read More
ALEXANDRIA, Va., Feb. 19 -- United States Patent no. 12,231,029, issued on Feb. 18, was assigned to INTDEVICE Ltd. (Auckland, New Zealand). "Soft switching sub-circuit" was invented by Li Jun Yu (Auc... Read More
ALEXANDRIA, Va., Feb. 19 -- United States Patent no. 12,227,740, issued on Feb. 18, was assigned to REGENERON PHARMACEUTICALS INC. (Tarrytown, N.Y.). "CBLB endonuclease variants, compositions, and me... Read More
ALEXANDRIA, Va., Feb. 19 -- United States Patent no. 12,231,081, issued on Feb. 18, was assigned to RMH TECH LLC (Colorado Springs, Colo.). "PV module mounting assembly with clamp/standoff arrangemen... Read More
ALEXANDRIA, Va., Feb. 19 -- United States Patent no. 12,230,593, issued on Feb. 18, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Wafer level package with polyme... Read More