Exclusive

Publication

Byline

Location

US Patent Issued to BOE Technology Group on April 8 for "Thin film transistor with silicon nanowire channel, display substrate, and display device" (Chinese Inventors)

ALEXANDRIA, Va., April 9 -- United States Patent no. 12,272,754, issued on April 8, was assigned to BOE Technology Group Co. Ltd. (Beijing). "Thin film transistor with silicon nanowire channel, displ... Read More


US Patent Issued to Richtek Technology on April 8 for "Control circuit and method for use in stackable multiphase power converter" (Taiwanese Inventors)

ALEXANDRIA, Va., April 9 -- United States Patent no. 12,273,035, issued on April 8, was assigned to Richtek Technology Corp. (Hsinchu, Taiwan). "Control circuit and method for use in stackable multip... Read More


US Patent Issued to Xilinx on April 8 for "Testbench for sub-design verification" (Indian, American Inventors)

ALEXANDRIA, Va., April 9 -- United States Patent no. 12,271,670, issued on April 8, was assigned to Xilinx Inc. (San Jose, Calif.). "Testbench for sub-design verification" was invented by Rajvinder S... Read More


US Patent Issued to GM Cruise Holdings on April 8 for "Rideshare service fleet optimization using vehicle sensor data" (California, Pennsylvania Inventors)

ALEXANDRIA, Va., April 9 -- United States Patent no. 12,271,841, issued on April 8, was assigned to GM Cruise Holdings LLC (San Francisco). "Rideshare service fleet optimization using vehicle sensor ... Read More


US Patent Issued to Seiko Epson on April 8 for "Transport apparatus" (Japanese Inventor)

ALEXANDRIA, Va., April 9 -- United States Patent no. 12,271,139, issued on April 8, was assigned to Seiko Epson Corp. (Tokyo). "Transport apparatus" was invented by Satoshi Omoto (Nagano, Japan). Ac... Read More


US Patent Issued to SAMSUNG ELECTRONICS on April 8 for "Semiconductor package having interposer substrate" (South Korean Inventors)

ALEXANDRIA, Va., April 9 -- United States Patent no. 12,272,628, issued on April 8, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor package having interposer subs... Read More


US Patent Issued to LG Electronics on April 8 for "Method for controlling calculations of deep neural network in wireless communication system, and apparatus therefor" (South Korean Inventors)

ALEXANDRIA, Va., April 9 -- United States Patent no. 12,273,159, issued on April 8, was assigned to LG Electronics Inc. (Seoul, South Korea). "Method for controlling calculations of deep neural netwo... Read More


US Patent Issued to Applied Materials on April 8 for "Wideband variable impedance load for high volume manufacturing qualification and on-site diagnostics" (California Inventors)

ALEXANDRIA, Va., April 9 -- United States Patent no. 12,272,524, issued on April 8, was assigned to Applied Materials Inc. (Santa Clara, Calif.). "Wideband variable impedance load for high volume man... Read More


US Patent Issued to RESTEK on April 8 for "High aspect ratio vacuum air sampling assembly" (Pennsylvania Inventors)

ALEXANDRIA, Va., April 9 -- United States Patent no. 12,270,737, issued on April 8, was assigned to RESTEK Corp. (Bellefonte, Pa.). "High aspect ratio vacuum air sampling assembly" was invented by Mi... Read More


US Patent Issued to Vorwerk & Co. Interholding on April 8 for "System comprised of a floor processing device, a memory device and at least one accessory device" (German Inventor)

ALEXANDRIA, Va., April 9 -- United States Patent no. 12,268,352, issued on April 8, was assigned to Vorwerk & Co. Interholding GmbH (Wuppertal, Germany). "System comprised of a floor processing devic... Read More