ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,482,868, issued on Nov. 25, was assigned to Tyco Fire & Security GmbH (Neuhausen am Rheinfall, Switzerland). "Lithium battery passivation detec... Read More
ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,479,850, issued on Nov. 25, was assigned to SHANGHAI INSTITUTE OF MATERIA MEDICA, CHINESE ACADEMY OF SCIENCES (Shanghai). "Compound having Axl ... Read More
ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,481,156, issued on Nov. 25, was assigned to SEIKO EPSON Corp. (Tokyo). "Optical module and head-mounted display device" was invented by Mitsuta... Read More
ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,482,446, issued on Nov. 25, was assigned to BRITISH CAYMAN ISLANDS INTELLIGO TECHNOLOGY INC. (Grand Cayman, Cayman Islands). "Audio device with... Read More
ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,481,995, issued on Nov. 25. "Secure financial transaction and electronic identification system" was invented by Marvin William Harper (Folcroft... Read More
ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,481,253, issued on Nov. 25, was assigned to SAUDI ARABIAN OIL COMPANY (Dhahran, Saudi Arabia). "Method and system for determining steam trap da... Read More
ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,481,533, issued on Nov. 25, was assigned to DISH WIRELESS LLC (Englewood, Colo.). "Updated atomic deterministic next action" was invented by Sh... Read More
ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,481,919, issued on Nov. 25, was assigned to BUSINESS OBJECTS SOFTWARE LTD. (Dublin). "Discrimination likelihood estimate for trained machine le... Read More
ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,480,878, issued on Nov. 25, was assigned to MAX-PLANCK-GESELLSCHAFT ZUR FOERDERUNG DER WISSENSCHAFTEN E.V. (Munich). "Method and illumination a... Read More
ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,482,771, issued on Nov. 25, was assigned to WALTON ADVANCED ENGINEERING INC. (Kaohsiung, Taiwan). "Chip package with higher bearing capacity in... Read More