ALEXANDRIA, Va., July 16 -- United States Patent no. 12,362,602, issued on July 15, was assigned to KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY (Daejeon, South Korea). "Wireless power transmis... Read More
ALEXANDRIA, Va., July 16 -- United States Patent no. 12,362,916, issued on July 15, was assigned to Cisco Technology Inc. (San Jose, Calif.). "Providing connection data to network devices for content... Read More
ALEXANDRIA, Va., July 16 -- United States Patent no. 12,362,786, issued on July 15, was assigned to Lenovo (Singapore) Pte. Ltd. (Singapore). "Calculating an EVM of an antenna port" was invented by C... Read More
ALEXANDRIA, Va., July 16 -- United States Patent no. 12,357,643, issued on July 15, was assigned to Marius Pharmaceuticals Inc. (Raleigh, N.C.). "Emulsion formulations" was invented by Om Dhingra (Mo... Read More
ALEXANDRIA, Va., July 16 -- United States Patent no. 12,358,953, issued on July 15, was assigned to iNtRON Biotechnology Inc. (Seongnam-si, South Korea). "Antibacterial protein having lytic activity ... Read More
ALEXANDRIA, Va., July 16 -- United States Patent no. 12,363,539, issued on July 15, was assigned to Eilsa Oyj (Helsinki). "Method and system for detecting anomaly in radio access network" was invente... Read More
ALEXANDRIA, Va., July 16 -- United States Patent no. D1,084,330, issued on July 15, was assigned to SIBBO Medical Devices Oy (Helsinki). "Otoscope" was invented by Tuomas Klockars (Helsinki). The pa... Read More
ALEXANDRIA, Va., July 16 -- United States Patent no. 12,359,497, issued on July 15, was assigned to 3D Global Pty Ltd (Murarrie, Australia). "Barrier system with independent fence and gate modules" w... Read More
ALEXANDRIA, Va., July 16 -- United States Patent no. 12,357,839, issued on July 15, was assigned to ZOLL Medical Corp. (Chelmsford, Mass.). "Remote monitoring devices and related methods and systems ... Read More
ALEXANDRIA, Va., July 16 -- United States Patent no. 12,362,197, issued on July 15, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Semiconductor die package with ring... Read More