ALEXANDRIA, Va., Nov. 6 -- United States Patent no. 12,463,286, issued on Nov. 4, was assigned to SK On Co. Ltd. (Seoul, South Korea). "Battery module" was invented by Jong Hyuk Lee (Daejeon, South K... Read More
ALEXANDRIA, Va., Nov. 6 -- United States Patent no. 12,459,903, issued on Nov. 4, was assigned to Mannkind Corp. (Valencia, Calif.). "Formation of n-protected 3,6-bis-(4-aminoalkyl)-2,5,diketopiperaz... Read More
ALEXANDRIA, Va., Nov. 6 -- United States Patent no. 12,461,224, issued on Nov. 4, was assigned to GM Cruise Holdings LLC (San Francisco). "Velocity disambiguation for radar sensor system" was invente... Read More
ALEXANDRIA, Va., Nov. 6 -- United States Patent no. 12,462,581, issued on Nov. 4, was assigned to Honda Motor Co. Ltd. (Tokyo) and The Board of Trustees of the Leland Stanford Junior University (Stanf... Read More
ALEXANDRIA, Va., Nov. 6 -- United States Patent no. 12,463,192, issued on Nov. 4, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Method of forming integrated circuit ... Read More
ALEXANDRIA, Va., Nov. 6 -- United States Patent no. D1,100,463, issued on Nov. 4, was assigned to Saucony Inc. (Waltham, Mass.). "Footwear upper" was invented by Brian D. Therriault (Framingham, Mass... Read More
ALEXANDRIA, Va., Nov. 6 -- United States Patent no. D1,100,667, issued on Nov. 4, was assigned to LCM Cosmetic Co. Ltd. (Incheon, South Korea). "Cosmetic container" was invented by Hyunjin Park (Seou... Read More
ALEXANDRIA, Va., Nov. 6 -- United States Patent no. 12,459,276, issued on Nov. 4, was assigned to Ricoh Co. Ltd. (Tokyo). "Contact member, drying apparatus, and printing apparatus for treating liquid... Read More
ALEXANDRIA, Va., Nov. 6 -- United States Patent no. 12,458,404, issued on Nov. 4, was assigned to SMITH & NEPHEW INC. (Memphis, Tenn.), SMITH & NEPHEW ORTHOPAEDICS AG (Zug, Switzerland) and SMITH & NE... Read More
ALEXANDRIA, Va., Nov. 6 -- United States Patent no. 12,463,179, issued on Nov. 4, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Semiconductor package and method for fabricati... Read More