Exclusive

Publication

Byline

Location

US Patent Issued to Microsoft Technology Licensing on April 29 for "Enforcing both syntactic and semantic correctness of domain-specific data queries" (Washington Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,287,781, issued on April 29, was assigned to Microsoft Technology Licensing LLC (Redmond, Wash.). "Enforcing both syntactic and semantic correct... Read More


US Patent Issued to SK hynix on April 29 for "Memory device and operating method for target refresh operation based on number of accesses" (South Korean Inventor)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,288,580, issued on April 29, was assigned to SK hynix Inc. (Gyeonggi-do, South Korea). "Memory device and operating method for target refresh op... Read More


US Patent Issued to THE BANK OF NEW YORK MELLON on April 29 for "System and methods for controlled access to computer resources" (New Jersey, Virginia, Texas Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,289,313, issued on April 29, was assigned to THE BANK OF NEW YORK MELLON (New York). "System and methods for controlled access to computer resou... Read More


US Patent Issued to HACH LANGE on April 29 for "Water sampling immersion probe" (German Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,287,316, issued on April 29, was assigned to HACH LANGE GMBH (Berlin). "Water sampling immersion probe" was invented by Manfred Battefeld (Dusse... Read More


US Patent Issued on April 29 for "Current-splitter circuit for LED lighting systems" (California Inventor)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,289,812, issued on April 29. "Current-splitter circuit for LED lighting systems" was invented by Alain Richard Comeau (Escondido, Calif.). Acco... Read More


US Patent Issued to IBIDEN on April 29 for "Wiring substrate and method for manufacturing wiring substrate" (Japanese Inventor)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,289,838, issued on April 29, was assigned to IBIDEN Co. Ltd. (Ogaki, Japan). "Wiring substrate and method for manufacturing wiring substrate" wa... Read More


US Patent Issued to Vitesco Technologies on April 29 for "Fluid-conveying device with valves for controlling the fluid flow" (German Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,287,652, issued on April 29, was assigned to Vitesco Technologies GmbH (Regensburg, Germany). "Fluid-conveying device with valves for controllin... Read More


US Patent Issued to LG DISPLAY on April 29 for "Thin film transistor, gate driver including the same, and display device including the same" (South Korean Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,289,909, issued on April 29, was assigned to LG DISPLAY Co. LTD. (Seoul, South Korea). "Thin film transistor, gate driver including the same, an... Read More


US Patent Issued to CAPITAL ONE SERVICES on April 29 for "Systems and methods of sharing an augmented environment with a companion" (Illinois, Virginia Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,288,250, issued on April 29, was assigned to CAPITAL ONE SERVICES LLC (McLean, Va.). "Systems and methods of sharing an augmented environment wi... Read More


US Patent Issued to AGCO International on April 29 for "Method for the production of a reinforced thermoplastic container" (German Inventor)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,285,890, issued on April 29, was assigned to AGCO International GmbH (Neuhausen, Switzerland). "Method for the production of a reinforced thermo... Read More